⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| Cyclohexane SCHEMBL9446384 | 1.00 | — | — | |
| SCHEMBL1468850 | 1.00 | — | — | |
| Cyclohexane SCHEMBL36894 | 1.00 | — | — | |
| SCHEMBL2904126 | 1.00 | — | — | |
| Cyclohexane SCHEMBL25380016 | 0.93 | — | — | |
| Cyclohexane SCHEMBL37158 | 0.93 | — | — | |
| SCHEMBL16775 | 0.87 | — | — | |
| SCHEMBL194072 | 0.87 | — | — | |
| Ethylene Glycol SCHEMBL4135001 | 0.84 | TSHR (0.30) | — | |
| SCHEMBL2196025 | 0.82 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 17 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| WO-2023223923-A1 | HYDROXYL GROUP-CONTAINING COMPOUND, CURABLE RESIN COMPOSITION, CURED PRODUCT, AND LAYERED PRODUCT | DIC株式会社 | 2023-11-23 | — | — | WO | disclosed |
| WO-2023223924-A1 | GLYCIDYL ETHER GROUP-CONTAINING COMPOUND, CURABLE RESIN COMPOSITION, CURED OBJECT, AND LAMINATE | DIC株式会社 | 2023-11-23 | — | — | WO | disclosed |
| WO-2023223925-A1 | PHENOLIC HYDROXY GROUP-CONTAINING COMPOUND, CURABLE RESIN COMPOSITION, CURED PRODUCT, AND LAMINATE | DIC株式会社 | 2023-11-23 | — | — | WO | disclosed |
| WO-2023223927-A1 | GLYCIDYL ETHER GROUP-CONTAINING COMPOUND, CURABLE RESIN COMPOSITION, CURED PRODUCT, AND LAMINATE | DIC株式会社 | 2023-11-23 | — | — | WO | disclosed |
| WO-2023223926-A1 | GLYCIDYL ETHER GROUP-CONTAINING COMPOUND, CURABLE RESIN COMPOSITION, CURED PRODUCT, AND LAMINATE | DIC株式会社 | 2023-11-23 | — | — | WO | disclosed |
| US-20100160587-A1 | THERMOSETTING RESIN COMPOSITION AND OPTICAL MEMBER USING CURED PRODUCT OF THE THERMOSETTING RESIN COMPOSITION | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2010-06-24 | — | — | US | disclosed |
| EP-2141203-A1 | THERMOSETTING RESIN COMPOSITION AND OPTICAL MEMBER USING CURED PRODUCT OF THE THERMOSETTING RESIN COMPOSITION | Hitachi Chemical Company, Ltd. (JP) | 2010-01-06 | — | — | EP | disclosed |
| US-7569654-B2 | Epoxy resin composition, process for producing epoxy resin, novel epoxy resin, novel phenol resin | DIC CORPORATION (JP) | 2009-08-04 | — | — | US | disclosed |
| US-7456247-B2 | Phenolic resin formed from a difunctional phenol and a divinyl ether | DAINIPPON INK AND CHEMICALS, INC. (JP) | 2008-11-25 | — | — | US | disclosed |
| US-7365147-B2 | Epoxy resin composition, process for producing epoxy resin, novel epoxy resin, novel phenol resin | DAINIPPON INK AND CHEMICALS, INC. (JP) | 2008-04-29 | — | — | US | disclosed |
| US-20060247392-A1 | Epoxy resin composition, process for producing epoxy resin, novel epoxy resin, novel phenol resin | DAINIPPON INK AND CHEMICALS, INC. (JP) | 2006-11-02 | — | — | US | disclosed |
| US-20060241274-A1 | Epoxy resin composition, process for producing epoxy resin, novel epoxy resin, novel phenol resin | DAINIPPON INK AND CHEMICALS, INC. (JP) | 2006-10-26 | — | — | US | disclosed |
| US-20060235183-A1 | Epoxy resin composition, process for producing epoxy resin, novel epoxy resin, novel phenol resin | DAINIPPON INK AND CHEMICALS, INC. (JP) | 2006-10-19 | — | — | US | disclosed |
| US-7087702-B2 | Epoxy resin composition, process for producing epoxy resin, novel epoxy resin, novel phenol resin | DAINIPPON INK AND CHEMICALS, INC. (JP) | 2006-08-08 | — | — | US | disclosed |
| EP-1411101-B1 | Epoxy resin composition and process for producing epoxy resins | DAINIPPON INK & CHEMICALS (JP) | 2006-04-19 | — | — | EP | disclosed |
| US-20040087740-A1 | Epoxy resin composition, process for producing epoxy resin, novel epoxy resin, novel phenol resin | DAINIPPON INK AND CHEMICALS, INC. (JP) | 2004-05-06 | — | — | US | disclosed |
| EP-1411101-A1 | Epoxy resin composition, process for producing epoxy resin, novel epoxy resin, novel phenol resin | DAINIPPON INK AND CHEMICALS, INC. (JP) | 2004-04-21 | — | — | EP | disclosed |