SCHEMBL29064652

SCHEMBL29064652

C1CCC2OC2C1.CCC1(C(=O)O)C=CC=CC1C(=O)O

nearest known ligand 0.30

Predicted protein targets (top 3)

geneUniProtsupporting neighboursconfidence
PPM1B O75688 1/20 0.30
PTPN1 P18031 1/20 0.30
PPP1CC P36873 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL3022477 0.85
SCHEMBL1355666 0.73
SCHEMBL28863508 0.72
SCHEMBL1356375 0.71
SCHEMBL3039803 0.70 POLA1 (0.34)
SCHEMBL1355698 0.69
SCHEMBL3033173 0.69 POLA1 (0.36) PTPN1
SCHEMBL211984 0.68
SCHEMBL1549079 0.68
SCHEMBL9285389 0.66

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 7 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-117999296-A Composition and photosensitive composition 东京应化工业株式会社 2024-05-07 CN disclosed
CN-117980346-A Composition and photosensitive composition 东京应化工业株式会社 2024-05-03 CN disclosed
CN-117908327-A Composition and photosensitive composition 东京应化工业株式会社 2024-04-19 CN disclosed
CN-117908326-A Photosensitive composition 东京应化工业株式会社 2024-04-19 CN disclosed
CN-117178001-A Photocurable composition 东京应化工业株式会社 2023-12-05 CN disclosed
CN-112088185-B Resin composition, sealing sheet, and sealing body 琳得科株式会社 2023-09-26 CN disclosed
CN-112292435-B Sealant composition, sealing sheet, and sealing body 琳得科株式会社 2023-09-01 CN disclosed