SCHEMBL29066928

SCHEMBL29066928

CCC1CCC2OC2C1.CO[SiH](OC)OC

nearest known ligand 0.31

Predicted protein targets (top 2)

geneUniProtsupporting neighboursconfidence
PTGS1 P23219 1/20 0.31
PTGS2 P35354 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL13300115 0.86
SCHEMBL13118397 0.86
SCHEMBL1439871 0.86
SCHEMBL14364783 0.86
SCHEMBL17766094 0.81 PTGS1 (0.31) PTGS1PTGS2
SCHEMBL17766109 0.77 PPM1B (0.33)
SCHEMBL12570098 0.77
SCHEMBL12570097 0.77
SCHEMBL17766129 0.76 PPM1B (0.30)
SCHEMBL3741980 0.76 PTGS1 (0.32) PTGS1PTGS2

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 6 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-116496738-B Low-viscosity underfill capable of being quickly cured at low temperature and preparation method thereof 深圳市安伯斯科技有限公司 2024-01-30 CN claimed
CN-116496738-A Low-viscosity underfill capable of being quickly cured at low temperature and preparation method thereof 深圳市安伯斯科技有限公司 2023-07-28 CN claimed
CN-116496738-B Low-viscosity underfill capable of being quickly cured at low temperature and preparation method thereof 深圳市安伯斯科技有限公司 2024-01-30 CN disclosed
CN-117177941-A Silica sol having particle size distribution and method for producing same 日产化学株式会社 2023-12-05 CN disclosed
CN-116731287-A Modified epoxy resin composition, UV (ultraviolet) curing adhesive and preparation method 深圳市安伯斯科技有限公司 2023-09-12 CN disclosed
CN-116496738-A Low-viscosity underfill capable of being quickly cured at low temperature and preparation method thereof 深圳市安伯斯科技有限公司 2023-07-28 CN disclosed