SCHEMBL29091809

SCHEMBL29091809

CCOC(CCCCCNC(N)=O)OCC

nearest known ligand 0.45

Predicted protein targets (top 18)

geneUniProtsupporting neighboursconfidence
EPHX1 P07099 7/20 0.45
GNAI3 P08754 1/20 0.40
GNAO1 P09471 1/20 0.40
GNAI1 P63096 1/20 0.40
RRM1 P23921 1/20 0.38
DPP7 Q9UHL4 2/20 0.38
KDM4E B2RXH2 1/20 0.36
MAPK1 P28482 1/20 0.36
HIF1A Q16665 1/20 0.36
SIRT6 Q8N6T7 1/20 0.36
SIRT1 Q96EB6 1/20 0.36
CA12 O43570 1/20 0.36
CA1 P00915 1/20 0.36
CA2 P00918 1/20 0.36
CA9 Q16790 1/20 0.36
MEN1 O00255 1/20 0.35
KMT2A Q03164 1/20 0.35
PAOX Q6QHF9 2/20 0.35

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL28909954 0.81 EPHX1 (0.36) EPHX1GNAI3GNAO1GNAI1RRM1
SCHEMBL5611920 0.78 KMT2A (0.41) EPHX1KDM4EMEN1KMT2A
SCHEMBL28752727 0.78 EPHX1 (0.44) EPHX1RRM1DPP7CA12CA1
SCHEMBL20592353 0.77 EPHX1 (0.34) EPHX1CA12CA1CA2CA9
SCHEMBL29140938 0.77 DPP7 (0.35) EPHX1GNAI3GNAO1GNAI1RRM1
SCHEMBL1547403 0.77 KDM4E (0.50) EPHX1KDM4EMAPK1HIF1ACA12
SCHEMBL3717942 0.77 EPHX1 (0.48) EPHX1DPP7CA12CA1CA2
SCHEMBL6062528 0.77 EPHX1 (0.48) EPHX1DPP7CA12CA1CA2
SCHEMBL19468504 0.76 EPHX1 (0.43) EPHX1GNAI3GNAO1GNAI1RRM1
SCHEMBL19468498 0.76 EPHX1 (0.43) EPHX1GNAI3GNAO1GNAI1RRM1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 2 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-120153318-A Photosensitive resin composition, method for producing cured relief pattern using same, and method for producing polyimide film 旭化成株式会社 2025-06-13 CN disclosed
CN-116710498-A Polyimide precursor resin composition and method for producing same 旭化成株式会社 2023-09-05 CN disclosed