SCHEMBL2909571

SCHEMBL2909571

C=CCCC=C(CCCCCC)C(=O)O

nearest known ligand 0.46

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
EP300 Q09472 1/20 0.46
TSHR P16473 5/20 0.45
FAAH O00519 2/20 0.45
PPARG P37231 7/20 0.44
PPARD Q03181 7/20 0.44
PPARA Q07869 7/20 0.44
PTPN1 P18031 4/20 0.44
TERT O14746 3/20 0.44
MAPT P10636 3/20 0.44
HSD17B10 Q99714 3/20 0.44
FABP4 P15090 3/20 0.44
TDP1 Q9NUW8 3/20 0.44
BLM P54132 2/20 0.44
ALOX15 P16050 2/20 0.44
KMT2A Q03164 2/20 0.44
GMNN O75496 1/20 0.44
USP2 O75604 1/20 0.44
LMNA P02545 1/20 0.44
CYP1A2 P05177 1/20 0.44
POLB P06746 1/20 0.44

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL16594756 0.92 TSHR (0.53) EP300TSHRFAAHPPARGPPARD
Ethylene SCHEMBL17728027 0.86 EP300 (0.48) EP300TSHRFAAHPPARGPPARD
SCHEMBL7047628 0.85 EP300 (0.62) EP300TSHRFAAHPPARGPPARD
SCHEMBL4381274 0.85 EP300 (0.62) EP300TSHRFAAHPPARGPPARD
SCHEMBL1814145 0.85 EP300 (0.62) EP300TSHRFAAHPPARGPPARD
SCHEMBL23086204 0.85 EP300 (0.62) EP300TSHRFAAHPPARGPPARD
SCHEMBL1077925 0.85 EP300 (0.62) EP300TSHRFAAHPPARGPPARD
SCHEMBL20954084 0.85 EP300 (0.62) EP300TSHRFAAHPPARGPPARD
SCHEMBL20954083 0.85 EP300 (0.62) EP300TSHRFAAHPPARGPPARD
SCHEMBL3421630 0.85 EP300 (0.62) EP300TSHRFAAHPPARGPPARD

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-1812297-B1 PROCESS FOR PACKAGING PLASTIC MATERIALS LIKE HOT MELT ADHESIVES BOSTIK INC (US) 2010-08-04 EP disclosed
US-20080118689-A1 Process for Packaging Plastic Materials Like Hot Melt Adhesives BOSTIK, INC. 2008-05-22 US disclosed
EP-1812297-A1 PROCESS FOR PACKAGING PLASTIC MATERIALS LIKE HOT MELT ADHESIVES Bostik, Inc. (US) 2007-08-01 EP disclosed
WO-2006050108-A1 PROCESS FOR PACKAGING PLASTIC MATERIALS LIKE HOT MELT ADHESIVES BOSTIK, INC. (US) 2006-05-11 WO disclosed