SCHEMBL29110554

SCHEMBL29110554

CC1C[Si](C)(C)[Si](C)(C)[Si](C)(C)O1.C[Si]1(C)CCO[Si](C)(C)[Si]1(C)C

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL253040 0.84
SCHEMBL29176423 0.82
SCHEMBL316903 0.79
SCHEMBL29066683 0.76
SCHEMBL29152747 0.70
SCHEMBL8168318 0.69
SCHEMBL3749483 0.63
SCHEMBL28698869 0.62 SMN1; SMN2 (0.46)
SCHEMBL28675492 0.56
SCHEMBL28602562 0.56

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 2 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-117098824-A Adhesive composition, laminate, method for producing laminate, and method for producing processed substrate 日产化学株式会社 2023-11-21 CN disclosed
CN-116508132-A Laminate, method for producing laminate, and method for producing semiconductor substrate 日产化学株式会社 2023-07-28 CN disclosed