SCHEMBL29133983

SCHEMBL29133983

CC(C)c1ccc(O)cc1.[H+]

nearest known ligand 0.65

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
ESR1 P03372 9/20 0.65
ESR2 Q92731 8/20 0.65
PDCD1 Q15116 1/20 0.65
CD274 Q9NZQ7 1/20 0.65
TYR P14679 3/20 0.52
LMNA P02545 2/20 0.50
CYP3A4 P08684 2/20 0.50
MAPT P10636 2/20 0.50
ALOX15 P16050 2/20 0.50
PTGS1 P23219 2/20 0.50
TDP1 Q9NUW8 2/20 0.50
CYP1A2 P05177 1/20 0.50
PGR P06401 1/20 0.50
CHRM2 P08172 1/20 0.50
ADORA3 P0DMS8 1/20 0.50
AR P10275 1/20 0.50
CYP2D6 P10635 1/20 0.50
CHRM1 P11229 1/20 0.50
CYP2C9 P11712 1/20 0.50
DRD1 P21728 1/20 0.50

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
Hydroquinone SCHEMBL9580215 0.97 ESR1 (0.68) ESR1ESR2PDCD1CD274TYR
SCHEMBL28954 0.97 ESR1 (0.68) ESR1ESR2PDCD1CD274TYR
Hydrogen Sulfide SCHEMBL27992656 0.94 ESR1 (0.65) ESR1ESR2PDCD1CD274TYR
SCHEMBL27568003 0.94 ESR1 (0.65) ESR1ESR2PDCD1CD274TYR
SCHEMBL28800543 0.94 ESR1 (0.65) ESR1ESR2PDCD1CD274TYR
SCHEMBL27525142 0.94 ESR1 (0.65) ESR1ESR2PDCD1CD274TYR
SCHEMBL30171502 0.94 ESR1 (0.65) ESR1ESR2PDCD1CD274TYR
SCHEMBL28657617 0.94 ESR1 (0.65) ESR1ESR2PDCD1CD274TYR
Benzene SCHEMBL1602387 0.92 ESR1 (0.62) ESR1ESR2PDCD1CD274TYR
Methylamine SCHEMBL27516879 0.92 ESR1 (0.62) ESR1ESR2PDCD1CD274TYR

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 1 patent. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-117209960-A Preparation of three-dimensional double-heat-conducting network skeleton and epoxy-based heat-conducting composite material thereof 安徽大学 2023-12-12 CN claimed