Predicted protein targets (top 8)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | NR1H2 | P55055 | 2/20 | 0.40 |
| ▸ | NR1H3 | Q13133 | 2/20 | 0.40 |
| ▸ | ESR1 | P03372 | 1/20 | 0.40 |
| ▸ | ESR2 | Q92731 | 1/20 | 0.40 |
| ▸ | CES2 | O00748 | 1/20 | 0.33 |
| ▸ | CES1 | P23141 | 1/20 | 0.33 |
| ▸ | MAPT | P10636 | 1/20 | 0.32 |
| ▸ | NR1I2 | O75469 | 1/20 | 0.30 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL4619514 | 0.98 | NR1H2 (0.39) | NR1H2NR1H3ESR1ESR2CES2 | |
| SCHEMBL10486795 | 0.98 | NR1H2 (0.39) | NR1H2NR1H3ESR1ESR2CES2 | |
| SCHEMBL2919598 | 0.88 | ESR1 (0.44) | NR1H2NR1H3ESR1ESR2CES2 | |
| SCHEMBL12160321 | 0.84 | ESR1 (0.41) | NR1H2NR1H3ESR1ESR2CES2 | |
| SCHEMBL12979079 | 0.84 | ESR1 (0.41) | NR1H2NR1H3ESR1ESR2CES2 | |
| SCHEMBL12979782 | 0.84 | ESR1 (0.41) | NR1H2NR1H3ESR1ESR2CES2 | |
| SCHEMBL14418535 | 0.84 | ESR1 (0.41) | NR1H2NR1H3ESR1ESR2CES2 | |
| SCHEMBL10387746 | 0.82 | NR1H2 (0.40) | NR1H2NR1H3ESR1ESR2CES2 | |
| SCHEMBL15800382 | 0.82 | NR1H2 (0.40) | NR1H2NR1H3ESR1ESR2CES2 | |
| SCHEMBL18692028 | 0.78 | NR1H2 (0.38) | NR1H2NR1H3ESR1ESR2CES2 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 24 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-3133105-B1 | HYDROSILYL-CONTAINING ORGANOPOLYSILOXANE, MAKING METHOD, ADDITION CURABLE SILICONE COMPOSITION, AND SEMICONDUCTOR PACKAGE | SHINETSU CHEMICAL CO (JP) | 2020-12-09 | — | — | EP | disclosed |
| US-9994711-B2 | Condensation-curable silicone composition and a semiconductor device | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2018-06-12 | — | — | US | disclosed |
| US-9890251-B2 | Hydrosilyl-containing organopolysiloxane, making method, addition curable silicone composition, and semiconductor package | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2018-02-13 | — | — | US | disclosed |
| US-9862803-B2 | Branched organopolysiloxane and a method for preparing the same | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2018-01-09 | — | — | US | disclosed |
| US-9587075-B2 | Addition-curable silicone composition and a semiconductor device | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2017-03-07 | — | — | US | disclosed |
| EP-3133105-A1 | HYDROSILYL-CONTAINING ORGANOPOLYSILOXANE, MAKING METHOD, ADDITION CURABLE SILICONE COMPOSITION, AND SEMICONDUCTOR PACKAGE | Shin-Etsu Chemical Co., Ltd. (JP) | 2017-02-22 | — | — | EP | disclosed |
| US-20170029571-A1 | HYDROSILYL-CONTAINING ORGANOPOLYSILOXANE, MAKING METHOD, ADDITION CURABLE SILICONE COMPOSITION, AND SEMICONDUCTOR PACKAGE | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2017-02-02 | — | — | US | disclosed |
| US-20160304675-A1 | BRANCHED ORGANOPOLYSILOXANE AND A METHOD FOR PREPARING THE SAME | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2016-10-20 | — | — | US | disclosed |
| US-20160304673-A1 | ADDITION-CURABLE SILICONE COMPOSITION AND A SEMICONDUCTOR DEVICE | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2016-10-20 | — | — | US | disclosed |
| US-20160280959-A1 | CONDENSATION-CURABLE SILICONE COMPOSITION AND A SEMICONDUCTOR DEVICE | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2016-09-29 | — | — | US | disclosed |
| EP-1334975-B1 | Silylation of hydroxyl group-containing compounds | SHINETSU CHEMICAL CO (JP) | 2006-07-12 | — | — | EP | disclosed |
| US-6924008-B2 | Curable resin composition, a method for the preparation thereof, and a coated article thereof | DAICEL CHEMICAL INDUSTRIES, LTD. (JP) | 2005-08-02 | — | — | US | disclosed |
| US-6875880-B2 | Silylation of hydroxyl groups | SHIN-ETSU CHEMICAL, CO., LTD. (JP) | 2005-04-05 | — | — | US | disclosed |
| EP-1334975-A1 | Silylation of hydroxyl group-containing compounds | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2003-08-13 | — | — | EP | disclosed |
| US-20030139619-A1 | Silylation of hydroxyl groups | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2003-07-24 | — | — | US | disclosed |
| US-20030032729-A1 | Curable resin composition, process for producing the same, and coated object made with the same | DAICEL CHEMICAL INDUSTRIES, LTD. (JP) | 2003-02-13 | — | — | US | disclosed |
| US-6437090-B1 | ORGANOMETALLIC COMPOUND CAPABLE OF REVERSIBLY DISSOLVING AND PRECIPITATING THROUGH HEATING AND COOLING; ORGANOSILICON COMPOUND; ONE LIGAND CONTAINS AN ALKYL GROUP HAVING 10 OR MORE CARBON ATOMS; EPOXY RESIN; STORAGE STABLE; ONLY CURES ON HEAT | KABUSHIKI KAISHA TOSHIBA (JP) | 2002-08-20 | — | — | US | disclosed |
| EP-1172393-A1 | CURABLE RESIN COMPOSITION, PROCESS FOR PRODUCING THE SAME, AND COATED OBJECT MADE WITH THE SAME | DAICEL CHEMICAL INDUSTRIES, Ltd. (JP) | 2002-01-16 | — | — | EP | disclosed |
| US-6096836-A | OXYGEN CONTAINING AROMATIC CATALYST AND ALUMINUM COMPOUND | KABUSHIKI KAISHA TOSHIBA (JP) | 2000-08-01 | — | — | US | disclosed |
| US-5811497-A | STORAGE STABLE EPOXY RESINS ACTIVATE THE CURING WHEN APPLYING THE HEAT; FLEXIBILITY, DIELECTRIC, MECHANICAL STRENGTH | KABUSHIKI KAISHA TOSHIBA (JP) | 1998-09-22 | — | — | US | disclosed |