⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL6849504 | 0.80 | — | — | |
| SCHEMBL574582 | 0.78 | — | — | |
| SCHEMBL574583 | 0.78 | — | — | |
| SCHEMBL28145237 | 0.75 | — | — | |
| SCHEMBL20583732 | 0.72 | — | — | |
| SCHEMBL20583731 | 0.72 | — | — | |
| SCHEMBL5713377 | 0.71 | — | — | |
| SCHEMBL433762 | 0.69 | — | — | |
| SCHEMBL21617944 | 0.69 | — | — | |
| SCHEMBL1983075 | 0.69 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 7 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-119955422-A | High-adhesive-degree high-reliability ultraviolet light curing adhesive composition with high vehicle-gauge | 上海汉司实业有限公司 | 2025-05-09 | — | — | CN | claimed |
| CN-118620528-A | UV (ultraviolet) delay curing adhesive and preparation method thereof | 浙江国能科技有限公司 | 2024-09-10 | — | — | CN | claimed |
| CN-119955422-A | High-adhesive-degree high-reliability ultraviolet light curing adhesive composition with high vehicle-gauge | 上海汉司实业有限公司 | 2025-05-09 | — | — | CN | disclosed |
| CN-119866352-A | Resin composition, resin sheet, multilayer printed wiring board, and semiconductor device | 日本化药株式会社 | 2025-04-22 | — | — | CN | disclosed |
| CN-118620528-A | UV (ultraviolet) delay curing adhesive and preparation method thereof | 浙江国能科技有限公司 | 2024-09-10 | — | — | CN | disclosed |
| CN-118043198-A | Laminated film, laminated body, and package | 东洋纺株式会社 | 2024-05-14 | — | — | CN | disclosed |
| CN-117642291-A | Laminated film for forming inorganic film layer | 东洋纺株式会社 | 2024-03-01 | — | — | CN | disclosed |