⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL31087388 | 1.00 | — | — | |
| SCHEMBL31042798 | 0.87 | — | — | |
| SCHEMBL2709812 | 0.87 | — | — | |
| SCHEMBL29350895 | 0.82 | — | — | |
| SCHEMBL2293025 | 0.82 | — | — | |
| SCHEMBL29352163 | 0.82 | — | — | |
| SCHEMBL4410587 | 0.82 | — | — | |
| SCHEMBL11799953 | 0.82 | — | — | |
| SCHEMBL15992528 | 0.82 | — | — | |
| SCHEMBL6718327 | 0.82 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 77 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-116043289-B | Preparation method of nickel-platinum-aluminum bonding layer with nickel-tungsten-rhenium diffusion barrier coating | 中国航空制造技术研究院 | 2025-04-29 | — | — | CN | claimed |
| CN-119307873-A | High-temperature oxidation-resistant low-diffusion nickel-platinum-aluminum coating and preparation process thereof | 中国航空制造技术研究院 | 2025-01-14 | — | — | CN | claimed |
| CN-117845294-A | Method for preparing nickel-platinum-aluminum coating by nickel-aluminum codeposition in ionic liquid | 中国航空制造技术研究院 | 2024-04-09 | — | — | CN | claimed |
| EP-3636541-B1 | SHAPE MEMORY ALLOY ACTIVE SPARS FOR BLADE TWIST | BOEING CO (US) | 2023-07-05 | — | — | EP | claimed |
| CN-116043289-A | Preparation method of nickel-platinum-aluminum bonding layer with nickel-tungsten-rhenium diffusion barrier coating | 中国航空制造技术研究院 | 2023-05-02 | — | — | CN | claimed |
| EP-2664537-B1 | Shape memory alloy active spars for blade twist | BOEING CO (US) | 2020-07-08 | — | — | EP | claimed |
| US-10661885-B2 | Shape memory alloy active spars for blade twist | THE BOEING COMPANY (US) | 2020-05-26 | — | — | US | claimed |
| EP-3636541-A1 | SHAPE MEMORY ALLOY ACTIVE SPARS FOR BLADE TWIST | The Boeing Company (US) | 2020-04-15 | — | — | EP | claimed |
| CN-103180985-B | Thermocouple assembly and method | 剑桥企业有限公司 | 2017-09-19 | — | — | CN | claimed |
| US-20130309089-A1 | SHAPE MEMORY ALLOY ACTIVE SPARS FOR BLADE TWIST | THE BOEING COMPANY | 2013-11-21 | — | — | US | claimed |
| EP-2664537-A2 | Shape memory alloy active spars for blade twist | The Boeing Company (US) | 2013-11-20 | — | — | EP | claimed |
| CN-103180985-A | Thermocouple apparatus and method | CAMBRIDGE ENTPR LTD | 2013-06-26 | — | — | CN | claimed |
| US-20110062247-A1 | FLOW REGULATING ARTICLES AND METHODS OF MANUFACTURE | GENERAL ELECTRIC COMPANY (US) | 2011-03-17 | — | — | US | claimed |
| US-7854391-B2 | Flow regulating articles and methods of manufacture | GENERAL ELECTRIC COMPANY (US) | 2010-12-21 | — | — | US | claimed |
| US-20070252014-A1 | Flow regulating articles and methods of manufacture | GENERAL ELECTRIC COMPANY | 2007-11-01 | — | — | US | claimed |
| CN-116043289-B | Preparation method of nickel-platinum-aluminum bonding layer with nickel-tungsten-rhenium diffusion barrier coating | 中国航空制造技术研究院 | 2025-04-29 | — | — | CN | disclosed |
| CN-116043289-B | Preparation method of nickel-platinum-aluminum bonding layer with nickel-tungsten-rhenium diffusion barrier coating | 中国航空制造技术研究院 | 2025-04-29 | — | — | CN | disclosed |
| US-20030138658-A1 | Multilayer thermal barrier coating | PRAXAIR S.T. TECHNOLOGY, INC. | 2003-07-24 | — | — | US | disclosed |
| US-20020144550-A1 | Liquid-quantity monitoring apparatus and liquid-consuming apparatus with the same | SEIKO EPSON CORPORATION | 2002-10-10 | — | — | US | disclosed |
| EP-1245393-A1 | Liquid-quantitiy monitoring apparatus and liquid-consuming apparatus with the same | SEIKO EPSON CORPORATION (JP) | 2002-10-02 | — | — | EP | disclosed |