⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL16751113 | 0.81 | — | — | |
| SCHEMBL15264087 | 0.81 | — | — | |
| SCHEMBL21003660 | 0.81 | — | — | |
| SCHEMBL12028430 | 0.81 | — | — | |
| SCHEMBL15263259 | 0.81 | — | — | |
| SCHEMBL33100 | 0.81 | — | — | |
| SCHEMBL3910581 | 0.75 | — | — | |
| SCHEMBL16488541 | 0.75 | — | — | |
| SCHEMBL18317871 | 0.72 | — | — | |
| SCHEMBL75076 | 0.71 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 146 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-2087041-A2 | HYBRID CATIONIC CURABLE COATINGS | Eques Coatings (NL) | 2009-08-12 | — | — | EP | claimed |
| WO-2008071363-A2 | HYBRID CATIONIC CURABLE COATINGS | EQUES COATINGS (NL) | 2008-06-19 | — | — | WO | claimed |
| EP-0785242-B1 | Carrier for electrostatic latent image development and coating agent for use therein | DOW CORNING TORAY SILICONE (JP) | 2002-01-23 | — | — | EP | claimed |
| EP-0785242-A2 | Carrier for electrostatic latent image development and coating agent for use therein | Dow Corning Toray Silicone Company Limited (JP) | 1997-07-23 | — | — | EP | claimed |
| EP-0465669-B1 | PHOTOCURABLE RESIN COMPOSITION | NIPPON PETROCHEMICALS CO LTD (JP) | 1996-04-03 | — | — | EP | claimed |
| EP-3632950-B1 | STORAGE-STABLE HEAT-CURABLE HYBRID EPOXY FUNCTIONAL COMPOSITION AND TRANSPARENT HEAT-CURED COATINGS PREPARED THEREFROM | ESSILOR INT (FR) | 2024-07-17 | — | — | EP | disclosed |
| CN-114341294-B | Pressure-sensitive adhesive layer-forming polyorganosiloxane composition and use thereof | 陶氏东丽株式会社 | 2024-05-28 | — | — | CN | disclosed |
| CN-112654657-B | Storage-stable, heat-curable hybrid epoxy-functional compositions and transparent heat-cured coatings prepared therefrom | 依视路国际公司 | 2024-03-19 | — | — | CN | disclosed |
| US-20240087941-A1 | INTEGRATED DICING DIE BONDING SHEET AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE | DOW TORAY CO LTD (JP) | 2024-03-14 | — | — | US | disclosed |
| CN-116601252-A | Dicing die bonding sheet and method for manufacturing semiconductor device | 陶氏东丽株式会社 | 2023-08-15 | — | — | CN | disclosed |
| US-11709290-B2 | Heat curable epoxy compositions and transparent heat-cured coatings with durable adhesion prepared therefrom | ESSILOR INTERNATIONAL (FR) | 2023-07-25 | — | — | US | disclosed |
| US-20230050175-A1 | CURABLE ORGANOPOLYSILOXANE COMPOSITION, CURED PRODUCT THEREOF, PROTECTIVE AGENT OR ADHESIVE, AND ELECTRIC/ELECTRONIC DEVICE | DOW TORAY CO., LTD. (JP) | 2023-02-16 | — | — | US | disclosed |
| EP-0832936-A1 | Photo-curable liquid silicone rubber compositions for templating mother molds | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 1998-04-01 | — | — | EP | disclosed |
| EP-0832726-A2 | Replica molding | Shonan Design Co., Ltd. (JP) | 1998-04-01 | — | — | EP | disclosed |
| EP-0785242-A2 | Carrier for electrostatic latent image development and coating agent for use therein | Dow Corning Toray Silicone Company Limited (JP) | 1997-07-23 | — | — | EP | disclosed |
| EP-0722990-A2 | Thermoplastic resin compositions for use in integral molding with silicone rubber and integrally molded parts | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 1996-07-24 | — | — | EP | disclosed |
| US-5521053-A | ADDUCT OF MALEINIZED DIENE POLYMER AND HYDROXYALKYL ACRYLATE | NIPPON PETROCHEMICALS CO., LTD. (JP) | 1996-05-28 | — | — | US | disclosed |
| EP-0465669-B1 | PHOTOCURABLE RESIN COMPOSITION | NIPPON PETROCHEMICALS CO LTD (JP) | 1996-04-03 | — | — | EP | disclosed |
| EP-0465669-A1 | PHOTOCURABLE RESIN COMPOSITION | NIPPON PETROCHEMICALS CO., LTD. (JP) | 1992-01-15 | — | — | EP | disclosed |
| EP-0130462-A2 | Printed circuits | AMOCO CORPORATION (US) | 1985-01-09 | — | — | EP | disclosed |