⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL8770802 | 0.87 | — | — | |
| SCHEMBL8853383 | 0.74 | — | — | |
| SCHEMBL248235 | 0.72 | — | — | |
| SCHEMBL15632661 | 0.72 | — | — | |
| SCHEMBL16670926 | 0.71 | — | — | |
| SCHEMBL18726527 | 0.71 | — | — | |
| SCHEMBL19272491 | 0.71 | — | — | |
| SCHEMBL7588930 | 0.70 | — | — | |
| SCHEMBL872282 | 0.69 | — | — | |
| SCHEMBL18831111 | 0.68 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 34 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-2198851-B1 | Thickened O/W emulsions | HENKEL AG & CO KGAA (DE) | 2018-03-07 | — | — | EP | claimed |
| EP-1902704-B1 | Cosmetic compositions containing a combination of silicon-elastomers | HENKEL AG & CO KGAA (DE) | 2013-11-06 | — | — | EP | claimed |
| EP-1934397-B1 | A LIQUID SILICONE RUBBER COMPOSITION FOR TEXTILE COATING | DOW CORNING LTD (GB) | 2013-02-27 | — | — | EP | claimed |
| EP-1360955-B1 | Cosmetic composition with a silicone elastomer and a thickening polymer in the latex form | HENKEL AG & CO KGAA (DE) | 2010-09-15 | — | — | EP | claimed |
| EP-0589386-B1 | Fluorosilicone rubber composition | DOW CORNING TORAY SILICONE (JP) | 1998-02-04 | — | — | EP | claimed |
| EP-0600301-B1 | Viscous coupling fluids | DOW CORNING ASIA LTD (JP) | 1997-12-03 | — | — | EP | claimed |
| EP-3831887-B1 | SILICONE GEL COMPOSITION AND CURED PRODUCT THEREOF, AND POWER MODULE | SHINETSU CHEMICAL CO (JP) | 2026-03-04 | — | — | EP | disclosed |
| WO-2025052793-A1 | COATING COMPOSITION FOR ELECTROCHEMICAL ELEMENT SEPARATORS, ELECTROCHEMICAL ELEMENT SEPARATOR, AND ELECTROCHEMICAL ELEMENT | 信越化学工業株式会社 | 2025-03-13 | — | — | WO | disclosed |
| EP-3662031-B1 | SILICONE COMPOSITION FOR TEMPORARY BONDING ADHESIVE, ELECTRONIC ARTICLE COMPRISING CURED BODY OF THE SAME, AND MANUFACTURING METHOD THEREOF | DOW SILICONES CORP (US) | 2024-10-09 | — | — | EP | disclosed |
| WO-2024106077-A1 | DISASSEMBLY METHOD FOR BONDED MEMBER AND EASILY-DISASSEMBLED SILICONE-BASED LIQUID ADHESIVE AGENT | 信越化学工業株式会社 | 2024-05-23 | — | — | WO | disclosed |
| US-11884820-B2 | Silicone gel composition and cured product thereof, and power module | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2024-01-30 | — | — | US | disclosed |
| US-20230203253-A1 | TWO-PACK ADDITION-CURABLE SILICONE RUBBER COMPOSITION | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2023-06-29 | — | — | US | disclosed |
| CN-113677750-B | Self-adhesive silicone gel composition and silicone gel comprising cured product thereof | 信越化学工业株式会社 | 2023-05-26 | — | — | CN | disclosed |
| US-20090304616-A1 | TRANSPARENT ANTIPERSPIRANT GEL | HENKEL AG & CO. KGAA (DE) | 2009-12-10 | — | — | US | disclosed |
| EP-0798343-B1 | Silicone rubber composition for fluorocarbon resin-coated fixing rolls and fluorocarbon resin-coated fixing rolls | DOW CORNING TORAY SILICONE (JP) | 2003-05-07 | — | — | EP | disclosed |
| EP-0798343-A2 | Silicone rubber composition for fluorocarbon resin-coated fixing rolls and fluorocarbon resin-coated fixing rolls | Dow Corning Toray Silicone Company, Limited (JP) | 1997-10-01 | — | — | EP | disclosed |
| EP-0540040-B1 | Room-temperature-curable organopolysiloxane composition | DOW CORNING TORAY SILICONE (JP) | 1996-01-24 | — | — | EP | disclosed |
| EP-0304958-B1 | Room temperature-curable organopolysiloxane composition | TORAY SILICONE CO (JP) | 1994-04-13 | — | — | EP | disclosed |
| EP-0572927-A1 | Low modulus room-temperature-curable organosiloxane composition | Dow Corning Toray Silicone Company Ltd. (JP) | 1993-12-08 | — | — | EP | disclosed |
| EP-0540040-A1 | Room-temperature-curable organopolysiloxane composition | Dow Corning Toray Silicone Company, Limited (JP) | 1993-05-05 | — | — | EP | disclosed |