SCHEMBL2935223

SCHEMBL2935223

[Co].[Ni].[Re].[S]

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL3613786 0.87
SCHEMBL2551966 0.87
SCHEMBL29388414 0.75
SCHEMBL5850249 0.75
SCHEMBL3795492 0.75
SCHEMBL5017415 0.75
SCHEMBL3171641 0.75
SCHEMBL28331178 0.75
SCHEMBL3777969 0.75
SCHEMBL5017414 0.75

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 5 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20130074993-A1 COMPOSITION AND METHOD FOR ALLOY HAVING IMPROVED STRESS RELAXATION RESISTANCE TYCO ELECTRONICS CORPORATION (US) 2013-03-28 US disclosed
US-8388890-B2 Coating for microelectromechanical system (MEMS) via plating; nickel alloy with rhenium, cobalt, and sulfur included as a microalloying addition; characterized by a uniform distribution of rhenium sulfide precipitates dispersed in a face-centered cubic structure of the nickel alloy; creep resistance TYCO ELECTRONICS CORPORATION (US) 2013-03-05 US disclosed
EP-1903120-B1 Nickel based alloy comprising cobalt and rhenium disulfide and method of applying it as a coating TYCO ELECTRONICS CORP (US) 2010-02-03 EP disclosed
US-20080202641-A1 COMPOSITION AND METHOD FOR ALLOY HAVING IMPROVED STRESS RELAXATION RESISTANCE TYCO ELECTRONICS CORPORATION (US) 2008-08-28 US disclosed
EP-1903120-A2 Nickel based alloy comprising cobalt and rhenium disulfide and method of applying it as a coating Tyco Electronics Corporation (US) 2008-03-26 EP disclosed