SCHEMBL29373374

SCHEMBL29373374

CC1(C#N)CCCCC1N=NC1CCCCC1(C)C#N

nearest known ligand 0.35

Predicted protein targets (top 3)

geneUniProtsupporting neighboursconfidence
KDM4E B2RXH2 1/20 0.35
MAPT P10636 1/20 0.35
TSHR P16473 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL3267805 1.00 KDM4E (0.35) KDM4EMAPTTSHR
SCHEMBL5693493 0.74 KDM4E (0.33) KDM4EMAPT
SCHEMBL5693498 0.74 KDM4E (0.33) KDM4EMAPT
SCHEMBL22986789 0.74 KDM4E (0.33) KDM4EMAPT
SCHEMBL5528421 0.72 KDM4E (0.36) KDM4EMAPT
Cyanide SCHEMBL27486314 0.71 PDE4A (0.33) KDM4EMAPT
SCHEMBL25758305 0.69 KDM4E (0.31) KDM4EMAPT
SCHEMBL16386240 0.67
SCHEMBL30792101 0.65
SCHEMBL24819011 0.65

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 3 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-113795547-B Curable composition and cured product 株式会社钟化 2023-06-23 CN disclosed
CN-115698177-A Heat-curable composition and cured product thereof 株式会社钟化 2023-02-03 CN disclosed
WO-2022024997-A1 ORGANIC POLYMER, CURABLE COMPOSITION, AND CURED PRODUCT 株式会社カネカ 2022-02-03 WO disclosed