SCHEMBL29401488

SCHEMBL29401488

Cc1cc(CC(C)C)c(O)c(-n2nc3ccc(Cl)cc3n2)c1

nearest known ligand 0.50

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
NPC1 O15118 8/20 0.50
RAB9A P51151 7/20 0.50
POLB P06746 2/20 0.40
LMNA P02545 2/20 0.38
KDM4E B2RXH2 5/20 0.35
ALDH1A1 P00352 5/20 0.35
HPGD P15428 2/20 0.35
CYP1A2 P05177 1/20 0.35
CYP2C9 P11712 1/20 0.35
CYP2C19 P33261 1/20 0.35
MAPT P10636 5/20 0.34
TP53 P04637 1/20 0.34
MEN1 O00255 3/20 0.34
KMT2A Q03164 3/20 0.34
ATM Q13315 2/20 0.34
SMN1; SMN2 Q16637 2/20 0.34
GABRA1 P14867 1/20 0.33
GABRB2 P47870 1/20 0.33
MC4R P32245 2/20 0.32
PTGER1 P34995 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL196019 1.00 NPC1 (0.50) NPC1RAB9APOLBLMNAKDM4E
SCHEMBL15910157 0.87 NPC1 (0.55) NPC1RAB9APOLBLMNAKDM4E
SCHEMBL2146927 0.86 NPC1 (0.53) NPC1RAB9APOLBLMNAKDM4E
SCHEMBL5697093 0.86 NPC1 (0.53) NPC1RAB9APOLBLMNAKDM4E
SCHEMBL12387038 0.86 NPC1 (0.59) NPC1RAB9APOLBLMNAKDM4E
SCHEMBL18951616 0.85 NPC1 (0.44) NPC1RAB9APOLBLMNAKDM4E
SCHEMBL9408785 0.85 NPC1 (0.52) NPC1RAB9APOLBLMNAKDM4E
SCHEMBL29260689 0.85 NPC1 (0.36) NPC1RAB9AKDM4EMAPTATM
SCHEMBL27929913 0.85 NPC1 (0.36) NPC1RAB9APOLBKDM4EALDH1A1
SCHEMBL29400095 0.84 NPC1 (0.36) NPC1RAB9AKDM4EMAPTTP53

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 103 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-116648313-B Resin composition, cured product, laminate, method for producing cured product, and semiconductor device 富士胶片株式会社 2025-05-16 CN disclosed
CN-114730132-B Curable resin composition, cured film, laminate, method for producing cured film, semiconductor device, and resin 富士胶片株式会社 2025-05-09 CN disclosed
CN-119937247-A Curable resin composition, resin film, cured film, laminate, method for producing cured film, and semiconductor device 富士胶片株式会社 2025-05-06 CN disclosed
CN-119654387-A Window film 琳得科株式会社 2025-03-18 CN disclosed
CN-114761466-B Curable resin composition, cured film, laminate, method for producing cured film, semiconductor device, and resin 富士胶片株式会社 2024-12-10 CN disclosed
CN-115190891-B Curable resin composition, cured film, laminate, method for producing cured film, and semiconductor device 富士胶片株式会社 2024-10-15 CN disclosed
CN-118742617-A Window film 琳得科株式会社 2024-10-01 CN disclosed
CN-114981360-B Curable resin composition, cured film, laminate, method for producing cured film, and semiconductor device 富士胶片株式会社 2024-09-10 CN disclosed
CN-118251619-A Infrared cut filter and method for manufacturing infrared cut filter 富士胶片株式会社 2024-06-25 CN disclosed
CN-115667404-B Curable resin composition, cured film, laminate, method for producing cured film, and semiconductor device 富士胶片株式会社 2024-05-03 CN disclosed
WO-2022059621-A1 RESIN COMPOSITION, CURED OBJECT, LAYERED PRODUCT, METHOD FOR PRODUCING CURED OBJECT, AND SEMICONDUCTOR DEVICE 富士フイルム株式会社 2022-03-24 WO disclosed
CN-114196246-A Coating agent for cyclic olefin resin, coating agent set, cured product, and laminate 荒川化学工业株式会社 2022-03-18 CN disclosed
WO-2022050041-A1 CURED PRODUCT PRODUCTION METHOD, LAMINATE PRODUCTION METHOD, AND ELECTRONIC DEVICE PRODUCTION METHOD 富士フイルム株式会社 2022-03-10 WO disclosed
WO-2022050135-A1 CURED PRODUCT PRODUCTION METHOD, LAMINATE PRODUCTION METHOD, AND SEMICONDUCTOR DEVICE PRODUCTION METHOD 富士フイルム株式会社 2022-03-10 WO disclosed
WO-2022050278-A1 CURABLE RESIN COMPOSITION, CURED OBJECT, LAYERED PRODUCT, METHOD FOR PRODUCING CURED OBJECT, SEMICONDUCTOR DEVICE, AND PHOTOBASE GENERATOR 富士フイルム株式会社 2022-03-10 WO disclosed
WO-2022045124-A1 CURABLE RESIN COMPOSITION, CURED PRODUCT, LAMINATE, METHOD FOR PRODUCING CURED PRODUCT, AND SEMICONDUCTOR DEVICE 富士フイルム株式会社 2022-03-03 WO disclosed
WO-2022045123-A1 METHOD FOR PRODUCING POLYIMIDE PRECURSOR AND METHOD FOR PRODUCING CURABLE RESIN COMPOSITION 富士フイルム株式会社 2022-03-03 WO disclosed
WO-2022045120-A1 PHOTOSENSITIVE RESIN COMPOSITION, CURED PRODUCT, LAMINATE, METHOD FOR MANUFACTURING CURED PRODUCT, AND SEMICONDUCTOR DEVICE 富士フイルム株式会社 2022-03-03 WO disclosed
WO-2022045060-A1 CURABLE RESIN COMPOSITION, CURED PRODUCT, MULTILAYER BODY, METHOD FOR PRODUCING CURED PRODUCT, AND SEMICONDUCTOR DEVICE 富士フイルム株式会社 2022-03-03 WO disclosed
WO-2022045059-A1 RESIN COMPOSITION, CURED PRODUCT, MULTILAYER BODY, METHOD FOR PRODUCING CURED PRODUCT, AND SEMICONDUCTOR DEVICE 富士フイルム株式会社 2022-03-03 WO disclosed