⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL6460712 | 0.87 | — | — | |
| SCHEMBL392289 | 0.84 | — | — | |
| SCHEMBL6461465 | 0.81 | — | — | |
| SCHEMBL6465521 | 0.79 | — | — | |
| SCHEMBL5585617 | 0.69 | — | — | |
| Water SCHEMBL28177905 | 0.66 | — | — | |
| SCHEMBL3220835 | 0.65 | — | — | |
| SCHEMBL28764796 | 0.65 | — | — | |
| SCHEMBL3612349 | 0.65 | — | — | |
| SCHEMBL17186679 | 0.63 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 1092 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| WO-2026099153-A1 | DEVICE CAPABLE OF BONDING AND DEBONDING ON DEMAND | TESA SE (DE) | 2026-05-15 | — | — | WO | claimed |
| EP-4731695-A1 | HEAT-CURING EPOXY RESIN COMPOSITION HAVING HIGH STORAGE STABILITY | Sika Technology AG (CH) | 2026-04-29 | — | — | EP | claimed |
| EP-4703496-A1 | ETCHING COMPOSITION COMPRISING AT LEAST ONE IONIC LIQUID AND AT LEAST ONE LACTAMIDE AND PROCESS FOR COATING PLASTIC SURFACES WITH METALS BY USING THE SAME | BASF SE (DE) | 2026-03-04 | — | — | EP | claimed |
| US-20250382408-A1 | EPOXY-TERMINATED ISOCYANATE PREPOLYMERS, AND PROCESS FOR THE PREPARATION THEREOF | BASF SE (DE) | 2025-12-18 | — | — | US | claimed |
| EP-4617650-A1 | FLEXIBLE ELECTROLYTE, PREPARATION METHOD THEREFOR AND APPLICATION THEREOF | Zhengzhou Winsen Electronics Technology Co., Ltd (CN) | 2025-09-17 | — | — | EP | claimed |
| EP-3275039-B1 | ELECTROLYTES AND METAL HYDRIDE BATTERIES | BASF CORP (US) | 2025-08-27 | — | — | EP | claimed |
| US-20250215275-A1 | Conductive Pressure Sensitive Adhesive | HENKEL AG & CO. KGAA (DE) | 2025-07-03 | — | — | US | claimed |
| EP-4180786-B1 | AN IONICALLY CONDUCTIVE COMPOSITION FOR USE IN A THERMAL SENSOR | HENKEL AG & CO KGAA (DE) | 2025-04-16 | — | — | EP | claimed |
| CN-119403855-A | Epoxy blocked isocyanate prepolymer and method for producing same | 巴斯夫欧洲公司 | 2025-02-07 | — | — | CN | claimed |
| WO-2024261069-A1 | HEAT-CURING EPOXY RESIN COMPOSITION HAVING HIGH STORAGE STABILITY | SIKA TECHNOLOGY AG (CH) | 2024-12-26 | — | — | WO | claimed |
| EP-1984438-A1 | ANTISTATIC POLYURETHANE | BASF SE (DE) | 2008-10-29 | — | — | EP | claimed |
| US-20080166243-A1 | Liquid for Compressing a Gaseous Medium and Use of the Same | LINDE AG (DE) | 2008-07-10 | — | — | US | claimed |
| WO-2008034820-A1 | MAGNETORHEOLOGICAL FORMULATION | BASF SE (DE) | 2008-03-27 | — | — | WO | claimed |
| WO-2008022983-A2 | CONDUCTIVE POLYMER GELS | BASF SE (DE) | 2008-02-28 | — | — | WO | claimed |
| EP-1877668-A1 | LIQUID FOR COMPRESSING A GASEOUS MEDIUM AND USE OF THE SAME | Linde AG (DE) | 2008-01-16 | — | — | EP | claimed |
| WO-2007090755-A1 | ANTISTATIC POLYURETHANE | BASF AKTIENGESELLSCHAFT (DE) | 2007-08-16 | — | — | WO | claimed |
| US-20070181856-A1 | Conductive wet coating composition and thin-film prepared therefrom | SAMSUNG DISPLAY CO., LTD. (KR) | 2007-08-09 | — | — | US | claimed |
| US-20070176148-A1 | Organic electroluminescence device | SAMSUNG DISPLAY CO., LTD. (KR) | 2007-08-02 | — | — | US | claimed |
| WO-2006120145-A1 | LIQUID FOR COMPRESSING A GASEOUS MEDIUM AND USE OF THE SAME | LINDE AG (DE) | 2006-11-16 | — | — | WO | claimed |
| WO-2006077082-A1 | METHOD FOR SEALING ROTATING SHAFTS | BASF AKTIENGESELLSCHAFT (DE) | 2006-07-27 | — | — | WO | claimed |