Predicted protein targets (top 10)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | ADORA2A | P29274 | 9/20 | 1.00 |
| ▸ | ADORA1 | P30542 | 4/20 | 1.00 |
| ▸ | ADORA2B | P29275 | 1/20 | 0.71 |
| ▸ | ADCY1 | Q08828 | 1/20 | 0.66 |
| ▸ | PI4KA | P42356 | 2/20 | 0.65 |
| ▸ | PI4K2B | Q8TCG2 | 2/20 | 0.65 |
| ▸ | PI4K2A | Q9BTU6 | 2/20 | 0.65 |
| ▸ | PI4KB | Q9UBF8 | 2/20 | 0.65 |
| ▸ | AHCY | P23526 | 7/20 | 0.63 |
| ▸ | ADCY5 | O95622 | 1/20 | 0.59 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL984944 | 1.00 | ADORA2A (1.00) | ADORA2AADORA1ADORA2BADCY1PI4KA | |
| Hydrochloric Acid SCHEMBL9193028 | 0.98 | ADORA2A (0.97) | ADORA2AADORA1ADORA2BADCY1PI4KA | |
| SCHEMBL1635576 | 0.90 | ADORA2A (1.00) | ADORA2AADORA1ADORA2BADCY1PI4KA | |
| SCHEMBL11222112 | 0.89 | ADORA2A (0.80) | ADORA2AADORA1ADORA2BPI4KAPI4K2B | |
| SCHEMBL19553487 | 0.89 | ADORA2A (0.91) | ADORA2AADORA1ADORA2BADCY1PI4KA | |
| SCHEMBL8467390 | 0.87 | ADORA2A (0.88) | ADORA2AADORA1ADORA2BADCY1PI4KA | |
| SCHEMBL1871838 | 0.86 | ADORA2A (0.75) | ADORA2AADORA1ADORA2BPI4KAPI4K2B | |
| SCHEMBL2638103 | 0.84 | ADORA2A (0.73) | ADORA2AADORA1ADORA2BPI4KAPI4K2B | |
| SCHEMBL5033136 | 0.84 | ADORA2A (0.73) | ADORA2AADORA1ADORA2BPI4KAPI4K2B | |
| SCHEMBL11487766 | 0.84 | ADORA2A (0.71) | ADORA2AADORA1ADORA2BADCY1PI4KA |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 28 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-118995124-A | Preparation method of base tackifying polythiooctanoic acid-based adhesive | 长春工业大学 | 2024-11-22 | — | — | CN | claimed |
| CN-120153318-A | Photosensitive resin composition, method for producing cured relief pattern using same, and method for producing polyimide film | 旭化成株式会社 | 2025-06-13 | — | — | CN | disclosed |
| CN-120129876-A | Negative photosensitive resin composition, method for producing polyimide cured film using same, and polyimide cured film | 旭化成株式会社 | 2025-06-10 | — | — | CN | disclosed |
| CN-119404296-A | Semiconductor processing liquid, method for processing object to be processed, and method for manufacturing electronic device | 富士胶片株式会社 | 2025-02-07 | — | — | CN | disclosed |
| WO-2025007801-A1 | PURINE DERIVATIVE AND USE THEREOF | 普美瑞(苏州)生物科技有限公司 | 2025-01-09 | — | — | WO | disclosed |
| CN-119215184-A | Pharmaceutical complex, pharmaceutical composition and use thereof | 聚天生医股份有限公司 | 2024-12-31 | — | — | CN | disclosed |
| CN-118995124-A | Preparation method of base tackifying polythiooctanoic acid-based adhesive | 长春工业大学 | 2024-11-22 | — | — | CN | disclosed |
| CN-118995124-A | Preparation method of base tackifying polythiooctanoic acid-based adhesive | 长春工业大学 | 2024-11-22 | — | — | CN | disclosed |
| CN-118946610-A | Hybrid bond insulating film forming material, method for manufacturing semiconductor device, and semiconductor device | 艾曲迪微系统股份有限公司 | 2024-11-12 | — | — | CN | disclosed |
| CN-118938601-A | Negative photosensitive resin composition and method for producing cured relief pattern | 旭化成株式会社 | 2024-11-12 | — | — | CN | disclosed |
| CN-113820920-B | Photosensitive resin composition, method for producing cured relief pattern, and semiconductor device | 旭化成株式会社 | 2023-07-04 | — | — | CN | disclosed |
| CN-116256943-A | Negative photosensitive resin composition, method for producing cured relief pattern, and semiconductor device | 旭化成株式会社 | 2023-06-13 | — | — | CN | disclosed |
| CN-115755526-A | Photosensitive resin composition and method for producing cured relief pattern | 旭化成株式会社 | 2023-03-07 | — | — | CN | disclosed |
| CN-115185157-A | Photosensitive resin composition, method for producing cured relief pattern, and semiconductor device | 旭化成株式会社 | 2022-10-14 | — | — | CN | disclosed |
| CN-115039029-A | Negative photosensitive resin composition and method for producing cured relief pattern | 旭化成株式会社 | 2022-09-09 | — | — | CN | disclosed |
| CN-114384756-A | Resin composition, toner for developing electrostatic image, image forming method, photosensitive adhesive, and photoswitch material | 柯尼卡美能达株式会社 | 2022-04-22 | — | — | CN | disclosed |
| EP-3980554-A1 | HYBRIDIZING ALL-LNA OLIGONUCLEOTIDES | F. Hoffmann-La Roche AG (CH) | 2022-04-13 | — | — | EP | disclosed |
| WO-2022071329-A1 | RESIN COMPOSITION, METHOD FOR PRODUCING SEMICONDUCTOR DEVICE, CURED OBJECT, SEMICONDUCTOR DEVICE, AND METHOD FOR SYNTHESIZING POLYIMIDE PRECURSOR | 昭和電工マテリアルズ株式会社 | 2022-04-07 | — | — | WO | disclosed |
| WO-2022070362-A1 | RESIN COMPOSITION, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, CURED PRODUCT, AND SEMICONDUCTOR DEVICE | 昭和電工マテリアルズ株式会社 | 2022-04-07 | — | — | WO | disclosed |
| CN-114207522-A | Negative photosensitive resin composition, method for producing polyimide, method for producing cured relief pattern, and semiconductor device | 旭化成株式会社 | 2022-03-18 | — | — | CN | disclosed |