⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL20592340 | 1.00 | — | — | |
| SCHEMBL20592339 | 0.82 | SMN1; SMN2 (0.48) | — | |
| SCHEMBL20592367 | 0.82 | POLA1 (0.72) | — | |
| SCHEMBL18614338 | 0.82 | POLA1 (0.65) | — | |
| SCHEMBL29459154 | 0.82 | POLA1 (0.72) | — | |
| SCHEMBL28004419 | 0.82 | — | — | |
| SCHEMBL18231630 | 0.81 | POLA1 (0.64) | — | |
| SCHEMBL1286951 | 0.81 | — | — | |
| SCHEMBL8537131 | 0.79 | — | — | |
| SCHEMBL29385103 | 0.79 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 18 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-120153318-A | Photosensitive resin composition, method for producing cured relief pattern using same, and method for producing polyimide film | 旭化成株式会社 | 2025-06-13 | — | — | CN | disclosed |
| CN-120129876-A | Negative photosensitive resin composition, method for producing polyimide cured film using same, and polyimide cured film | 旭化成株式会社 | 2025-06-10 | — | — | CN | disclosed |
| CN-118946610-A | Hybrid bond insulating film forming material, method for manufacturing semiconductor device, and semiconductor device | 艾曲迪微系统股份有限公司 | 2024-11-12 | — | — | CN | disclosed |
| CN-118938601-A | Negative photosensitive resin composition and method for producing cured relief pattern | 旭化成株式会社 | 2024-11-12 | — | — | CN | disclosed |
| CN-118922917-A | Composition, method for manufacturing semiconductor element, and method for cleaning semiconductor substrate | 富士胶片株式会社 | 2024-11-08 | — | — | CN | disclosed |
| CN-112334833-B | Negative photosensitive resin composition, polyimide using same, and method for producing cured relief pattern | 旭化成株式会社 | 2024-09-24 | — | — | CN | disclosed |
| CN-118363270-A | Negative photosensitive resin composition, method for producing cured relief pattern, and semiconductor device | 旭化成株式会社 | 2024-07-19 | — | — | CN | disclosed |
| CN-117784520-A | Photosensitive resin composition, method for producing resist pattern film, and method for producing plating molded article | JSR株式会社 | 2024-03-29 | — | — | CN | disclosed |
| CN-116609998-A | Polyimide precursor, negative photosensitive resin composition, and method for producing cured relief pattern using same | 旭化成株式会社 | 2023-08-18 | — | — | CN | disclosed |
| CN-113820920-B | Photosensitive resin composition, method for producing cured relief pattern, and semiconductor device | 旭化成株式会社 | 2023-07-04 | — | — | CN | disclosed |
| CN-116256943-A | Negative photosensitive resin composition, method for producing cured relief pattern, and semiconductor device | 旭化成株式会社 | 2023-06-13 | — | — | CN | disclosed |
| CN-115755526-A | Photosensitive resin composition and method for producing cured relief pattern | 旭化成株式会社 | 2023-03-07 | — | — | CN | disclosed |
| CN-115185157-A | Photosensitive resin composition, method for producing cured relief pattern, and semiconductor device | 旭化成株式会社 | 2022-10-14 | — | — | CN | disclosed |
| CN-115039029-A | Negative photosensitive resin composition and method for producing cured relief pattern | 旭化成株式会社 | 2022-09-09 | — | — | CN | disclosed |
| WO-2022154020-A1 | POLYIMIDE PRECURSOR RESIN COMPOSITION AND METHOD FOR MANUFACTURING SAME | 旭化成株式会社 | 2022-07-21 | — | — | WO | disclosed |
| WO-2022071329-A1 | RESIN COMPOSITION, METHOD FOR PRODUCING SEMICONDUCTOR DEVICE, CURED OBJECT, SEMICONDUCTOR DEVICE, AND METHOD FOR SYNTHESIZING POLYIMIDE PRECURSOR | 昭和電工マテリアルズ株式会社 | 2022-04-07 | — | — | WO | disclosed |
| WO-2022070362-A1 | RESIN COMPOSITION, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, CURED PRODUCT, AND SEMICONDUCTOR DEVICE | 昭和電工マテリアルズ株式会社 | 2022-04-07 | — | — | WO | disclosed |
| CN-114207522-A | Negative photosensitive resin composition, method for producing polyimide, method for producing cured relief pattern, and semiconductor device | 旭化成株式会社 | 2022-03-18 | — | — | CN | disclosed |