SCHEMBL29460360

SCHEMBL29460360

Cc1cc(C)c(C(=O)c2cccc([PH](=O)O)c2C(=O)c2c(C)cc(C)cc2C)c(C)c1

nearest known ligand 0.37

Predicted protein targets (top 18)

geneUniProtsupporting neighboursconfidence
KMT2A Q03164 5/20 0.37
HPGD P15428 3/20 0.37
LMNA P02545 3/20 0.37
MEN1 O00255 2/20 0.37
SMN1; SMN2 Q16637 1/20 0.37
NPSR1 Q6W5P4 1/20 0.37
MCOLN3 Q8TDD5 1/20 0.37
POLB P06746 1/20 0.33
METAP2 P50579 1/20 0.32
GAA P10253 2/20 0.31
KDM4E B2RXH2 2/20 0.31
CRHR1 P34998 1/20 0.31
ALDH1A1 P00352 1/20 0.31
HSD17B10 Q99714 1/20 0.31
BCL2L1 Q07817 1/20 0.31
ABCB1 P08183 1/20 0.31
CYP3A4 P08684 1/20 0.30
CYP2C9 P11712 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL22653917 1.00 KMT2A (0.37) KMT2AHPGDLMNAMEN1SMN1; SMN2
SCHEMBL1468442 0.88 KMT2A (0.40) KMT2AHPGDLMNAMEN1SMN1; SMN2
SCHEMBL2688955 0.84 KMT2A (0.42) KMT2AHPGDLMNAMEN1SMN1; SMN2
SCHEMBL29404838 0.83 POLB (0.35) KMT2AHPGDLMNAMEN1SMN1; SMN2
SCHEMBL1041651 0.81 KMT2A (0.38) KMT2AHPGDLMNAMEN1SMN1; SMN2
SCHEMBL28390846 0.80 KMT2A (0.35) KMT2AHPGDLMNAMEN1SMN1; SMN2
SCHEMBL29669706 0.80 KMT2A (0.33) KMT2AHPGDLMNAMEN1SMN1; SMN2
SCHEMBL3685860 0.80 KMT2A (0.40) KMT2AHPGDLMNAMEN1SMN1; SMN2
SCHEMBL1138265 0.78 KMT2A (0.42) KMT2AHPGDLMNAMEN1SMN1; SMN2
SCHEMBL28236895 0.78 KMT2A (0.41) KMT2AHPGDLMNAMEN1SMN1; SMN2

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 5 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20250300242-A1 METHOD OF MANUFACTURING MEMBER FOR ELECTROCHEMICAL ELEMENT AND APPARATUS FOR MANUFACTURING ELECTROCHEMICAL ELEMENT RICOH COMPANY, LTD. (JP) 2025-09-25 US disclosed
US-12384099-B2 Dual cure epoxy formulations for 3D printing applications HENKEL AG & CO. KGAA (DE) 2025-08-12 US disclosed
EP-3738771-B1 DUAL CURE EPOXY FORMULATIONS FOR 3D PRINTING APPLICATIONS HENKEL AG & CO KGAA (DE) 2023-08-16 EP disclosed
EP-3738772-B1 DUAL CURE POLYURETHANE FORMULATIONS FOR 3D PRINTING APPLICATIONS HENKEL AG & CO KGAA (DE) 2023-02-15 EP disclosed
US-20220055286-A1 DUAL CURE EPOXY FORMULATIONS FOR 3D PRINTING APPLICATIONS HENKEL AG & CO KGAA (DE) 2022-02-24 US disclosed