⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL29780148 | 1.00 | — | — | |
| SCHEMBL24390 | 0.95 | — | — | |
| SCHEMBL30185775 | 0.91 | — | — | |
| SCHEMBL30488584 | 0.91 | — | — | |
| SCHEMBL30447248 | 0.91 | — | — | |
| Ammonia Solution, Strong SCHEMBL29272054 | 0.91 | — | — | |
| SCHEMBL27677848 | 0.91 | — | — | |
| SCHEMBL28038066 | 0.81 | — | — | |
| SCHEMBL28247475 | 0.81 | — | — | |
| Acrylic Acid SCHEMBL241789 | 0.73 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 5 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-3780087-B1 | METHOD OF MANUFACTURING BONDED BODY FOR INSULATING CIRCUIT BOARD, AND BONDED BODY FOR INSULATING CIRCUIT BOARD | MITSUBISHI MATERIALS CORP (JP) | 2025-07-30 | — | — | EP | disclosed |
| US-12096547-B1 | High velocity plasma torch and method | BELASHCHENKO VLADIMIR E (US) | 2024-09-17 | — | — | US | disclosed |
| US-11908768-B2 | Method of manufacturing bonded body for insulation circuit substrate board and bonded body for insulation circuit substrate board | MITSUBISHI MATERIALS CORPORATION (JP) | 2024-02-20 | — | — | US | disclosed |
| US-20220173010-A1 | METHOD OF MANUFACTURING BONDED BODY FOR INSULATION CIRCUIT SUBSTRATE BOARD AND BONDED BODY FOR INSULATION CIRCUIT SUBSTRATE BOARD | MITSUBISHI MATERIALS CORPORATION (JP) | 2022-06-02 | — | — | US | disclosed |
| US-11289400-B2 | Method of manufacturing bonded body for insulation circuit substrate board and bonded body for insulation circuit substrate board | MITSUBISHI MATERIALS CORPORATION (JP) | 2022-03-29 | — | — | US | disclosed |