Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | ESR1 | P03372 | 1/20 | 0.65 |
| ▸ | ESR2 | Q92731 | 1/20 | 0.65 |
| ▸ | MEN1 | O00255 | 7/20 | 0.61 |
| ▸ | KMT2A | Q03164 | 7/20 | 0.61 |
| ▸ | MAPT | P10636 | 6/20 | 0.61 |
| ▸ | LMNA | P02545 | 4/20 | 0.61 |
| ▸ | SMN1; SMN2 | Q16637 | 4/20 | 0.61 |
| ▸ | KDM4E | B2RXH2 | 2/20 | 0.61 |
| ▸ | OPRK1 | P41145 | 1/20 | 0.61 |
| ▸ | ALDH1A1 | P00352 | 5/20 | 0.43 |
| ▸ | ALOX15 | P16050 | 4/20 | 0.43 |
| ▸ | GAA | P10253 | 4/20 | 0.43 |
| ▸ | HSD17B10 | Q99714 | 3/20 | 0.43 |
| ▸ | HPGD | P15428 | 3/20 | 0.43 |
| ▸ | ALOX12 | P18054 | 3/20 | 0.43 |
| ▸ | HTT | P42858 | 2/20 | 0.43 |
| ▸ | USP2 | O75604 | 1/20 | 0.43 |
| ▸ | HSP90AA1 | P07900 | 1/20 | 0.43 |
| ▸ | POLB | P06746 | 3/20 | 0.40 |
| ▸ | TSHR | P16473 | 1/20 | 0.39 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL31220287 | 1.00 | ESR1 (0.65) | ESR1ESR2MEN1KMT2AMAPT | |
| SCHEMBL1482551 | 1.00 | ESR1 (0.65) | ESR1ESR2MEN1KMT2AMAPT | |
| SCHEMBL31296636 | 1.00 | ESR1 (0.65) | ESR1ESR2MEN1KMT2AMAPT | |
| SCHEMBL8984558 | 0.94 | ESR1 (0.58) | ESR1ESR2MEN1KMT2AMAPT | |
| SCHEMBL4240467 | 0.86 | ESR1 (0.60) | ESR1ESR2MEN1KMT2AMAPT | |
| SCHEMBL16819102 | 0.85 | ESR1 (0.49) | ESR1ESR2MEN1KMT2AMAPT | |
| SCHEMBL20445906 | 0.85 | ESR1 (0.49) | ESR1ESR2MEN1KMT2AMAPT | |
| SCHEMBL31544678 | 0.84 | MEN1 (0.51) | ESR1ESR2MEN1KMT2AMAPT | |
| SCHEMBL5038739 | 0.84 | MEN1 (0.51) | ESR1ESR2MEN1KMT2AMAPT | |
| SCHEMBL6138389 | 0.83 | MEN1 (0.62) | ESR1ESR2MEN1KMT2AMAPT |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 62 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-119264429-A | Low-dielectric fluorine-containing silane modified polyimide and application thereof | 山东非金属材料研究所 | 2025-01-07 | — | — | CN | claimed |
| CN-118930858-A | High-dielectric high-temperature-resistant polyetherimide dielectric film and preparation method and application thereof | 南方电网科学研究院有限责任公司 | 2024-11-12 | — | — | CN | claimed |
| CN-118725295-A | Resin, preparation method and application of resin | 华为技术有限公司 | 2024-10-01 | — | — | CN | claimed |
| CN-115232017-B | Compound, resin and preparation method and application thereof | 华为技术有限公司 | 2024-06-18 | — | — | CN | claimed |
| CN-117987075-A | Adhesive with high binding force for lithium ion secondary battery and preparation method thereof | 桂林电器科学研究院有限公司 | 2024-05-07 | — | — | CN | claimed |
| CN-116003778-A | Preparation method of polyaryletherketone resin containing amino side group, polyaryletherketone resin containing amino side group and application | 中国科学院大连化学物理研究所 | 2023-04-25 | — | — | CN | claimed |
| CN-115746231-A | High-temperature-resistant and easy-to-process benzoxazole resin and preparation method and application thereof | 中国科学院宁波材料技术与工程研究所 | 2023-03-07 | — | — | CN | claimed |
| CN-115692709-A | Negative electrode slurry for lithium ion battery and preparation method thereof | 桂林电器科学研究院有限公司 | 2023-02-03 | — | — | CN | claimed |
| CN-115626890-A | Diamine monomer with bulky alkynyl side group and preparation method and application thereof | 波米科技有限公司 | 2023-01-20 | — | — | CN | claimed |
| CN-115232017-A | Compound, resin, and preparation method and application thereof | 华为技术有限公司 | 2022-10-25 | — | — | CN | claimed |
| CN-111499901-B | Preparation method of fluorine-containing polymer/polyimide composite film | 东莞东阳光科研发有限公司 | 2022-07-08 | — | — | CN | claimed |
| CN-122029216-A | Polyhydroxy amide compound, negative photosensitive resin composition, dry film, cured product, and electronic component | 太阳控股株式会社 | 2026-05-12 | — | — | CN | disclosed |
| CN-122029489-A | Photosensitive resin composition, cured product, display device, and electronic component | 东丽株式会社 | 2026-05-12 | — | — | CN | disclosed |
| US-20250205939-A1 | ANNULAR SEAL MATERIAL AND MANUFACTURING METHOD | VALQUA, LTD. (JP) | 2025-06-26 | — | — | US | disclosed |
| WO-2025128306-A1 | INDANE BIS-O-AMINOPHENOLS AND POLYMERS PREPARED THEREFROM | FUJIFILM ELECTRONIC MATERIALS U.S.A., INC. (US) | 2025-06-19 | — | — | WO | disclosed |
| CN-114721223-A | Photosensitive resin, photosensitive resin composition, cured product, pattern forming method, and integrated circuit device | 华为技术有限公司 | 2022-07-08 | — | — | CN | disclosed |
| CN-114488695-A | Photoresist lower layer material composition, preparation method thereof and photoresist lower coating | 苏州理硕科技有限公司 | 2022-05-13 | — | — | CN | disclosed |
| CN-109219593-B | Maleimide compound containing substituted or unsubstituted allyl group, process for producing the same, and composition and cured product using the same | DIC株式会社 | 2022-04-22 | — | — | CN | disclosed |
| CN-110734736-B | Adhesive for temporary bonding, adhesive layer, wafer processed body, and method for manufacturing semiconductor device using same | 东丽株式会社 | 2022-04-19 | — | — | CN | disclosed |
| WO-2022070946-A1 | PHOTOSENSITIVE RESIN COMPOSITION, CURED PRODUCT, DISPLAY DEVICE, AND METHOD FOR PRODUCING CURED PRODUCT | 東レ株式会社 | 2022-04-07 | — | — | WO | disclosed |