⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL31124710 | 0.87 | — | — | |
| SCHEMBL27691348 | 0.87 | — | — | |
| SCHEMBL27906033 | 0.82 | — | — | |
| SCHEMBL841508 | 0.82 | — | — | |
| SCHEMBL28315322 | 0.82 | — | — | |
| SCHEMBL185288 | 0.82 | — | — | |
| SCHEMBL30275025 | 0.82 | — | — | |
| SCHEMBL11503491 | 0.82 | — | — | |
| SCHEMBL59561 | 0.82 | — | — | |
| SCHEMBL25264473 | 0.67 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 50 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-116288566-A | Copper foil and surface treatment method and application thereof | 江苏铭丰电子材料科技有限公司 | 2023-06-23 | — | — | CN | claimed |
| CN-100353083-C | Rolling bearing | NSK LTD (JP) | 2007-12-05 | — | — | CN | claimed |
| CN-116288566-B | Copper foil and surface treatment method and application thereof | 江苏铭丰电子材料科技有限公司 | 2026-02-17 | — | — | CN | disclosed |
| EP-4691760-A1 | RESIN-COATED METAL SHEET AND RESIN-COATED METAL SHEET PRODUCTION METHOD | Toyo Kohan Co., Ltd. (JP) | 2026-02-11 | — | — | EP | disclosed |
| US-12363826-B2 | Copper-clad laminate, printed wiring board, semiconductor package and method for producing copper-clad laminate | RESONAC CORPORATION (JP) | 2025-07-15 | — | — | US | disclosed |
| WO-2024204591-A1 | RESIN-COATED METAL SHEET AND RESIN-COATED METAL SHEET PRODUCTION METHOD | 東洋鋼鈑株式会社 | 2024-10-03 | — | — | WO | disclosed |
| WO-2024009861-A1 | COPPER-CLAD LAMINATE, PRINTED WIRING BOARD, AND SEMICONDUCTOR PACKAGE | 株式会社レゾナック | 2024-01-11 | — | — | WO | disclosed |
| CN-116288566-A | Copper foil and surface treatment method and application thereof | 江苏铭丰电子材料科技有限公司 | 2023-06-23 | — | — | CN | disclosed |
| CN-116288566-A | Copper foil and surface treatment method and application thereof | 江苏铭丰电子材料科技有限公司 | 2023-06-23 | — | — | CN | disclosed |
| EP-3825121-A1 | COPPER-CLAD LAMINATE, PRINTED WIRING BOARD, SEMICONDUCTOR PACKAGE AND METHOD FOR PRODUCING COPPER-CLAD LAMINATE | Showa Denko Materials Co., Ltd. (JP) | 2021-05-26 | — | — | EP | disclosed |
| CN-112423982-A | Copper-clad laminate, printed wiring board, semiconductor package, and method for manufacturing copper-clad laminate | 昭和电工材料株式会社 | 2021-02-26 | — | — | CN | disclosed |
| CN-101460292-A | Production method and production device of organic resin coated metal plate | TOYO KOHAN CO LTD (JP) | 2009-06-17 | — | — | CN | disclosed |
| US-20090068353-A1 | by an extrusion lamination while removing the oligomer adhered to a roll; supplying an electric current to the electric conductive bodies, contact with surfaces of the pre-rolls by electrostatic pinning; ethylene isophthalate-ethylene terephthalate copolymer as thermoplastic resins | TOYO KOHAN CO., LTD. (JP) | 2009-03-12 | — | — | US | disclosed |
| EP-2022627-A1 | FLOCKED METAL PLATE, METHOD OF PRODUCING FLOCKED METAL PLATE AND ROOFING MATERIAL AND DUCT FOR AIR-CONDITIONING SYSTEM | Toyo Kohan Co., Ltd. (JP) | 2009-02-11 | — | — | EP | disclosed |
| WO-2008071220-A1 | PROCESS FOR PRODUCING AND STORING A SEMI-FINISHED PRODUCT MADE OF ELASTOMERIC MATERIAL | PIRELLI TYRE S.P.A. (IT) | 2008-06-19 | — | — | WO | disclosed |
| EP-1138467-B1 | DECORATIVE LAMINATE CONTAINING A RESIN FILM | TOYO KOHAN CO LTD (JP) | 2008-06-04 | — | — | EP | disclosed |
| CN-101100701-A | Method and device for producing sponge iron by using reducing gas prepared from coke oven gas | WENHUI ZHANG (CN) | 2008-01-09 | — | — | CN | disclosed |
| US-6579611-B1 | Resin film laminated on decorative plate comprising non-oriented polyester film containing crystallization accelerator with specified grain size, embosssed on one surface, and plate comprising metal, wood or inorganic board | TOYO KOHAN CO., LTD. (JP) | 2003-06-17 | — | — | US | disclosed |
| EP-1138467-A1 | RESIN FILM FOR PRODUCING DECORATIVE LAMINATE AND DECORATIVE LAMINATE CONTAINING THE RESIN FILM | Toyo Kohan Co., Ltd. (JP) | 2001-10-04 | — | — | EP | disclosed |
| US-4251329-A | Process for producing a highly corrosion resistant electroplated steel sheet | NIPPON STEEL CORPORATION (JP) | 1981-02-17 | — | — | US | disclosed |