SCHEMBL29508905

SCHEMBL29508905

CCCC(=O)CC(C)=O.CCCC(=O)CC(C)=O.[Pt+2]

nearest known ligand 0.56

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
KDM4E B2RXH2 1/20 0.56
KDM6B O15054 1/20 0.56
KDM5C P41229 1/20 0.56
EGLN1 Q9GZT9 1/20 0.56
PHF8 Q9UPP1 1/20 0.56
KDM2A Q9Y2K7 1/20 0.56
CES1 P23141 2/20 0.43
CES2 O00748 1/20 0.43
HDAC3 O15379 4/20 0.42
HDAC1 Q13547 4/20 0.42
HDAC2 Q92769 4/20 0.42
HDAC8 Q9BY41 4/20 0.42
HDAC6 Q9UBN7 1/20 0.42
FFAR3 O14843 3/20 0.41
ALDH1A1 P00352 3/20 0.40
TDP1 Q9NUW8 1/20 0.40
CTSD P07339 1/20 0.40
TSHR P16473 1/20 0.39
MGAM O43451 1/20 0.38
GAA P10253 1/20 0.38

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL29606532 1.00 KDM4E (0.56) KDM4EKDM6BKDM5CEGLN1PHF8
SCHEMBL84408 0.97
SCHEMBL11246639 0.94 KDM4E (0.56) KDM4EKDM6BKDM5CEGLN1PHF8
SCHEMBL22465795 0.94 KDM4E (0.56) KDM4EKDM6BKDM5CEGLN1PHF8
SCHEMBL29587799 0.94 KDM4E (0.56) KDM4EKDM6BKDM5CEGLN1PHF8
Hydrochloric Acid SCHEMBL23538998 0.94 KDM4E (0.56) KDM4EKDM6BKDM5CEGLN1PHF8
SCHEMBL1618717 0.94 KDM4E (0.56) KDM4EKDM6BKDM5CEGLN1PHF8
SCHEMBL29128828 0.94 KDM4E (0.56) KDM4EKDM6BKDM5CEGLN1PHF8
SCHEMBL11741913 0.94 KDM4E (0.56) KDM4EKDM6BKDM5CEGLN1PHF8
SCHEMBL11375337 0.94 KDM4E (0.56) KDM4EKDM6BKDM5CEGLN1PHF8

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 9 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-116113663-B Thermally conductive silicone composition and thermally conductive member 陶氏东丽株式会社 2025-06-13 CN disclosed
CN-119391160-A Photocurable fluoropolyether elastomer composition and method for bonding same 信越化学工业株式会社 2025-02-07 CN disclosed
CN-117840009-A Method for forming coating film of photocurable fluoropolyether elastomer composition 信越化学工业株式会社 2024-04-09 CN disclosed
CN-113165012-B Method for forming coating film of photocurable fluoropolyether elastomer composition 信越化学工业株式会社 2024-01-30 CN disclosed
CN-112996853-B Curable fluoropolyether rubber composition and optical member 信越化学工业株式会社 2023-10-27 CN disclosed
CN-115612448-B Organic silicon packaging adhesive for micro LED element and packaging method thereof 北京康美特科技股份有限公司 2023-08-25 CN disclosed
CN-114667317-A Photocurable fluoropolyether elastomer composition and method for bonding same 信越化学工业株式会社 2022-06-24 CN disclosed
CN-114521211-A Wafer processed body, temporary bonding material for wafer processing, and method for manufacturing thin wafer 信越化学工业株式会社 2022-05-20 CN disclosed
CN-111212876-B Method for producing cured organopolysiloxane, laminate, and optical component 陶氏东丽株式会社 2022-03-29 CN disclosed