⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| Strontium SCHEMBL29783151 | 1.00 | — | — | |
| Strontium SCHEMBL29598183 | 0.82 | — | — | |
| Strontium SCHEMBL30515425 | 0.82 | — | — | |
| Magnesium SCHEMBL31547218 | 0.82 | — | — | |
| Strontium SCHEMBL30050900 | 0.82 | — | — | |
| Barium SCHEMBL31083583 | 0.82 | — | — | |
| SCHEMBL15867 | 0.71 | — | — | |
| SCHEMBL8331638 | 0.71 | — | — | |
| SCHEMBL10895258 | 0.71 | — | — | |
| SCHEMBL11237316 | 0.71 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 39 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-11641064-B2 | 3D IC antenna array with laminated high-k dielectric | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. (TW) | 2023-05-02 | — | — | US | claimed |
| US-11295979-B2 | Semiconductor package device with integrated antenna and manufacturing method thereof | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (TW) | 2022-04-05 | — | — | US | claimed |
| US-20250366211-A1 | INTEGRATED CIRCUIT (IC) DEVICE, IC LAYOUT, AND METHOD OF GENERATING IC LAYOUT | TAIWAN SEMICONDUCTOR MFG CO LTD (TW) | 2025-11-27 | — | — | US | disclosed |
| US-20250323090-A1 | SEMICONDUCTOR STRUCTURE AND METHOD OF FORMING THE SAME | TAIWAN SEMICONDUCTOR MFG CO LTD (TW) | 2025-10-16 | — | — | US | disclosed |
| US-12406876-B2 | Semiconductor structure including isolation structure with dielectric stack and method of forming the same | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (TW) | 2025-09-02 | — | — | US | disclosed |
| US-20250239304-A1 | MEMORY DEVICE, METHOD OF MANUFACTURING, AND INTEGRATED CIRCUIT DEVICE | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. (TW) | 2025-07-24 | — | — | US | disclosed |
| US-20250226231-A1 | SEMICONDUCTOR STRUCTURE INCLUDING DISCHARGE STRUCTURES AND METHOD FOR FABRICATING THE SAME | TAIWAN SEMICONDUCTOR MFG CO LTD (TW) | 2025-07-10 | — | — | US | disclosed |
| US-20250217568-A1 | LAYOUT METHOD AND SEMICONDUCTOR STRUCTURE FOR IC | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (TW) | 2025-07-03 | — | — | US | disclosed |
| US-20250204053-A1 | INTEGRATED CIRCUIT (IC) DEVICE, IC LAYOUT, AND METHOD OF GENERATING IC LAYOUT | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. (TW) | 2025-06-19 | — | — | US | disclosed |
| US-12293918-B2 | Semiconductor structure including discharge structures and method for fabricating the same | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (TW) | 2025-05-06 | — | — | US | disclosed |
| US-20250125519-A1 | SEMICONDUCTOR PACKAGE WITH ANTENNA AND METHOD OF FORMING THE SAME | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. (TW) | 2025-04-17 | — | — | US | disclosed |
| US-20220406819-A1 | SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (TW) | 2022-12-22 | — | — | US | disclosed |
| US-20220406608-A1 | SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (TW) | 2022-12-22 | — | — | US | disclosed |
| US-20220271414-A1 | SEMICONDUCTOR PACKAGE WITH ANTENNA AND METHOD OF FORMING THE SAME | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. (TW) | 2022-08-25 | — | — | US | disclosed |
| US-20220262924-A1 | SEMICONDUCTOR DEVICE WITH REDUCED TRAP DEFECT AND METHOD OF FORMING THE SAME | TAIWAN SEMICONDUCTOR MFG CO LTD (TW) | 2022-08-18 | — | — | US | disclosed |
| US-20220237358-A1 | METHOD OF AND SYSTEM FOR MANUFACTURING SEMICONDUCTOR DEVICE | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. (TW) | 2022-07-28 | — | — | US | disclosed |
| US-20220216141-A1 | SEMICONDUCTOR STRUCTURE AND METHOD OF MANUFACTURING THE SAME | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (TW) | 2022-07-07 | — | — | US | disclosed |
| US-11329139-B2 | Semiconductor device with reduced trap defect and method of forming the same | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (TW) | 2022-05-10 | — | — | US | disclosed |
| US-11295979-B2 | Semiconductor package device with integrated antenna and manufacturing method thereof | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (TW) | 2022-04-05 | — | — | US | disclosed |
| CN-108807632-B | Semiconductor light emitting device | 首尔伟傲世有限公司 | 2022-04-01 | — | — | CN | disclosed |