⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL2957733 | 0.77 | — | — | |
| SCHEMBL598663 | 0.66 | — | — | |
| SCHEMBL22619208 | 0.66 | — | — | |
| SCHEMBL21180936 | 0.66 | — | — | |
| SCHEMBL2749519 | 0.64 | HRH3 (0.30) | — | |
| SCHEMBL29743343 | 0.64 | — | — | |
| SCHEMBL21180944 | 0.63 | — | — | |
| SCHEMBL22619213 | 0.62 | HRH3 (0.30) | — | |
| SCHEMBL21181556 | 0.62 | HRH3 (0.30) | — | |
| SCHEMBL2863669 | 0.62 | HRH3 (0.35) | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 17 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-12466956-B2 | Electroconductive resin composition and molded article of same | DENKA COMPANY LIMITED (JP) | 2025-11-11 | — | — | US | disclosed |
| WO-2023189133-A1 | CONDUCTIVE RESIN COMPOSITION | デンカ株式会社 | 2023-10-05 | — | — | WO | disclosed |
| CN-112601786-B | Conductive resin composition and molded article thereof | 电化株式会社 | 2023-05-05 | — | — | CN | disclosed |
| US-20220392373-A1 | MUCOSAL TISSUE MODEL | DENKA COMPANY LIMITED (JP) | 2022-12-08 | — | — | US | disclosed |
| EP-4083969-A1 | MUCOSAL TISSUE MODEL | Denka Company Limited (JP) | 2022-11-02 | — | — | EP | disclosed |
| EP-3845600-B1 | ELECTROCONDUCTIVE RESIN COMPOSITION AND MOLDED ARTICLE OF SAME | DENKA COMPANY LTD (JP) | 2022-10-26 | — | — | EP | disclosed |
| CN-114787895-A | Mucosal tissue model | 电化株式会社 | 2022-07-22 | — | — | CN | disclosed |
| US-20210246314-A1 | ELECTROCONDUCTIVE RESIN COMPOSITION AND MOLDED ARTICLE OF SAME | DENKA COMPANY LIMITED (JP) | 2021-08-12 | — | — | US | disclosed |
| EP-3845600-A1 | ELECTROCONDUCTIVE RESIN COMPOSITION AND MOLDED ARTICLE OF SAME | Denka Company Limited (JP) | 2021-07-07 | — | — | EP | disclosed |
| CN-112601786-A | Conductive resin composition and molded article thereof | 电化株式会社 | 2021-04-02 | — | — | CN | disclosed |
| US-7749625-B2 | Fuel for fuel cell, fuel cell and application thereof | KURITA WATER INDUSTRIES LTD. (JP) | 2010-07-06 | — | — | US | disclosed |
| US-7470738-B2 | Non-aqueous absorbent and use thereof | SANYO CHEMICAL INDUSTRIES, LTD. (JP) | 2008-12-30 | — | — | US | disclosed |
| US-20080233438-A1 | Fuel for fuel cell, fuel cell and application thereof | KURITA WATER INDUSTRIES LTD. (JP) | 2008-09-25 | — | — | US | disclosed |
| EP-1705740-A1 | FUEL FOR FUEL CELL, FUEL CELL AND APPLICATION THEREOF | Kurita Water Industries Ltd. (JP) | 2006-09-27 | — | — | EP | disclosed |
| EP-1628334-A1 | POLISHING LIQUID FOR CMP PROCESS AND POLISHING METHOD | SANYO CHEMICAL INDUSTRIES LTD. (JP) | 2006-02-22 | — | — | EP | disclosed |
| US-20050136247-A1 | Non-aqueous absorbent and use thereof | SANYO CHEMICAL INDUSTRIES, LTD. (JP) | 2005-06-23 | — | — | US | disclosed |
| EP-1462460-A1 | NON-AQUEOUS ABSORBENT AND USE THEREOF | SANYO CHEMICAL INDUSTRIES, LTD. (JP) | 2004-09-29 | — | — | EP | disclosed |