SCHEMBL2955735

SCHEMBL2955735

Nc1ccc(Oc2ccccc2C(=O)c2ccc(C(=O)c3ccccc3Oc3ccc(N)cc3)cc2)cc1

nearest known ligand 0.54

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
CTNNB1 P35222 1/20 0.53
PARP10 Q53GL7 3/20 0.51
STS P08842 2/20 0.51
NCOA1 Q15788 1/20 0.47
NCOA3 Q9Y6Q9 1/20 0.47
SRD5A2 P31213 1/20 0.46
MAOA P21397 1/20 0.46
MAPT P10636 2/20 0.44
GAA P10253 1/20 0.44
SMN1; SMN2 Q16637 1/20 0.44
KMT2A Q03164 2/20 0.44
POLB P06746 1/20 0.43
ELANE P08246 1/20 0.43
ALDH1A1 P00352 1/20 0.42
CYP3A4 P08684 1/20 0.42
TSHR P16473 1/20 0.42
TDP1 Q9NUW8 1/20 0.42
MAPK1 P28482 1/20 0.42
NPC1 O15118 2/20 0.42
RAB9A P51151 1/20 0.42

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL9222559 0.98 CTNNB1 (0.51) CTNNB1PARP10STSNCOA1NCOA3
SCHEMBL7758624 0.98 PARP10 (0.54) CTNNB1PARP10STSNCOA1NCOA3
SCHEMBL3455047 0.95 CTNNB1 (0.56) CTNNB1PARP10STSNCOA1NCOA3
SCHEMBL28556876 0.91 CTNNB1 (0.58) CTNNB1PARP10STSNCOA1NCOA3
SCHEMBL10531269 0.91 CTNNB1 (0.47) CTNNB1PARP10STSNCOA1NCOA3
SCHEMBL28959092 0.90 CTNNB1 (0.56) CTNNB1PARP10STSNCOA1NCOA3
SCHEMBL9222770 0.89 CTNNB1 (0.49) CTNNB1PARP10STSNCOA1NCOA3
SCHEMBL30646150 0.89 CTNNB1 (0.49) CTNNB1PARP10STSNCOA1NCOA3
SCHEMBL8837165 0.89 MAPT (0.47) CTNNB1PARP10STSNCOA1NCOA3
SCHEMBL30472476 0.88 PARP10 (0.61) PARP10STSSRD5A2MAOAMAPT

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 11 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-5328979-A Thermoplastic copolyimides and composites therefrom THE UNIVERSITY OF AKRON (US) 1994-07-12 US claimed
US-7758927-B2 Laser-induced fabrication of metallic interlayers and patterns in polyimide films THE UNITED STATES OF AMERICA AS REPRESENTED BY THE ADMINISTRATOR OF THE NATIONAL AERONAUTICS AND SPACE ADMINISTRATION (US) 2010-07-20 US disclosed
WO-2006038914-A2 LASER-INDUCED FABRICATION OF METALLIC INTERLAYERS AND PATTERNS IN POLYIMIDE FILMS UNITED STATES OF AMERICA AS REPRESENTED BY THE ADMINISTRATOR OF THE NATIONAL AERONAUTICS AND SPACE ADMINISTRATION (US) 2006-04-13 WO disclosed
US-20050233154-A1 Laser-induced fabrication of metallic interlayers and patterns in polyimide films United States of America as represented by the Administrator of the National Aeronautics and 2005-10-20 US disclosed
US-20050119390-A1 Process for the simultaneous formation of surface and sub-surface metallic layers in polymer films USA AS REPRESENTED BY THE ADMINISTRATOR OF THE NATIONAL AERONAUTICS AND SPACE ADMINISTRATION (US) 2005-06-02 US disclosed
EP-0708795-A4 HEAT-RESISTANT POLYIMIDE BLENDS AND LAMINATES UNIV AKRON (US) 1996-08-07 EP disclosed
EP-0708795-A1 HEAT-RESISTANT POLYIMIDE BLENDS AND LAMINATES The University of Akron (US) 1996-05-01 EP disclosed
US-5397847-A Polyimide blend THE UNIVERSITY OF AKRON (US) 1995-03-14 US disclosed
WO-1995002627-A1 HEAT-RESISTANT POLYIMIDE BLENDS AND LAMINATES THE UNIVERSITY OF AKRON (US) 1995-01-26 WO disclosed
US-5328979-A Thermoplastic copolyimides and composites therefrom THE UNIVERSITY OF AKRON (US) 1994-07-12 US disclosed
US-4820791-A HIGH STRENGTH, SOLVENT,CHEMICAL AND IMPACT RESISTANT UNITED STATES OF AMERICA (US) 1989-04-11 US disclosed