⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL7260984 | 1.00 | — | — | |
| SCHEMBL477920 | 1.00 | — | — | |
| SCHEMBL1123100 | 1.00 | — | — | |
| SCHEMBL3235545 | 1.00 | — | — | |
| SCHEMBL7266234 | 1.00 | — | — | |
| SCHEMBL959326 | 1.00 | — | — | |
| SCHEMBL704022 | 0.97 | — | — | |
| SCHEMBL23658245 | 0.92 | TSHR (0.40) | — | |
| SCHEMBL996934 | 0.92 | TSHR (0.40) | — | |
| SCHEMBL216112 | 0.92 | TSHR (0.40) | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 51 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-4720163-A1 | SILOXANE COMPOSITION FOR LOWER TEMPERATURE ADHESION | GELEST, INC. (US) | 2026-04-08 | — | — | EP | disclosed |
| US-20260062519-A1 | CURABLE SILICONE COMPOSITION, CURED PRODUCT THEREOF, LAYERED BODY, AND OPTICAL DEVICE OR OPTICAL DISPLAY | DOW TORAY CO LTD (JP) | 2026-03-05 | — | — | US | disclosed |
| EP-3868833-B1 | CURABLE ORGANOPOLYSILOXANE COMPOSITION HAVING EXCELLENT COLD RESISTANCE, PATTERN FORMING METHOD, ELECTRONIC COMPONENTS, ETC | DOW TORAY CO LTD (JP) | 2025-09-03 | — | — | EP | disclosed |
| EP-4574910-A1 | CURABLE SILICONE COMPOSITION, CURED PRODUCT THEREOF, LAYERED BODY, AND OPTICAL DEVICE OR OPTICAL DISPLAY | Dow Toray Co., Ltd. (JP) | 2025-06-25 | — | — | EP | disclosed |
| CN-119790108-A | Curable silicone composition, cured product thereof, laminate, and optical device or optical display | 陶氏东丽株式会社 | 2025-04-08 | — | — | CN | disclosed |
| WO-2024248900-A1 | SILOXANE COMPOSITION FOR LOWER TEMPERATURE ADHESION | GELEST, INC. (US) | 2024-12-05 | — | — | WO | disclosed |
| US-20240400827-A1 | SILOXANE COMPOSITION FOR LOWER TEMPERATURE ADHESION | GELEST, INC. | 2024-12-05 | — | — | US | disclosed |
| US-20240376347-A1 | CURABLE HOT MELT ORGANOPOLYSILOXANE COMPOSITION, CURED PRODUCT THEREOF AND METHOD FOR PRODUCING FILM, ETC. COMPRISING SAME | DOW TORAY CO LTD (JP) | 2024-11-14 | — | — | US | disclosed |
| US-12134717-B2 | Curable silicone composition and cured product of same, multilayer body and method for producing same, and optical device or optical display | DOW TORAY CO., LTD. (JP) | 2024-11-05 | — | — | US | disclosed |
| EP-3683274-B1 | CURABLE ORGANOPOLYSILOXANE COMPOSITION, AND PATTERN FORMING METHOD | DOW TORAY CO LTD (JP) | 2024-10-30 | — | — | EP | disclosed |
| US-20170058103-A1 | ADHESION PROMOTER AND CURABLE ORGANOPOLYSILOXANE COMPOSITION CONTAINING SAME | DOW TORAY CO., LTD. (JP) | 2017-03-02 | — | — | US | disclosed |
| EP-3130632-A1 | ADHESION PROMOTER AND CURABLE ORGANOPOLYSILOXANE COMPOSITION CONTAINING SAME | Dow Corning Toray Co., Ltd. (JP) | 2017-02-15 | — | — | EP | disclosed |
| EP-3130643-A1 | CURABLE ORGANOPOLYSILOXANE COMPOSITION, AND PROTECTIVE-AGENT OR ADHESIVE-AGENT COMPOSITION FOR ELECTRICAL/ELECTRONIC COMPONENTS | Dow Corning Toray Co., Ltd. (JP) | 2017-02-15 | — | — | EP | disclosed |
| US-20140238471-A1 | Multi-Component Type Curable Silicone Rubber Composition, Material For Electronic Parts Using Such, And Solar Cell Module | DOW CORNING TORAY CO LTD (JP) | 2014-08-28 | — | — | US | disclosed |
| US-20100233482-A1 | Organic silicon oxide fine particles and preparation method thereof, porous film-forming composition, porous film and formation method thereof, and semiconductor device | HAMADA YOSHITAKA | 2010-09-16 | — | — | US | disclosed |
| US-7754330-B2 | Organic silicon oxide core-shell particles and preparation method thereof, porous film-forming composition, porous film and formation method thereof, and semiconductor device | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2010-07-13 | — | — | US | disclosed |
| EP-2163664-A1 | Method for depositing si-containing film, insulator film, and semiconductor device | Shin-Etsu Chemical Co., Ltd. (JP) | 2010-03-17 | — | — | EP | disclosed |
| US-20100061915-A1 | METHOD FOR DEPOSITING SI-CONTAINING FILM, INSULATOR FILM, AND SEMICONDUCTOR DEVICE | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2010-03-11 | — | — | US | disclosed |
| US-20090294922-A1 | ORGANIC SILICON OXIDE FINE PARTICLE AND PREPARATION METHOD THEREOF, POROUS FILM-FORMING COMPOSITION, POROUS FILM AND FORMATION METHOD THEREOF, AND SEMICONDUCTOR DEVICE | PANASONIC CORPORATION (JP) | 2009-12-03 | — | — | US | disclosed |
| US-20090294726-A1 | ORGANIC SILICON OXIDE FINE PARTICLES AND PREPARATION METHOD THEREOF, POROUS FILM-FORMING COMPOSITION, POROUS FILM AND FORMATION METHOD THEREOF, AND SEMICONDUCTOR DEVICE | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2009-12-03 | — | — | US | disclosed |