Predicted protein targets (top 4)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | IGF1R | P08069 | 20/20 | 1.00 |
| ▸ | EGFR | P00533 | 11/20 | 1.00 |
| ▸ | ERBB2 | P04626 | 11/20 | 1.00 |
| ▸ | CYP2D6 | P10635 | 1/20 | 0.82 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL2967949 | 1.00 | IGF1R (1.00) | IGF1REGFRERBB2CYP2D6 | |
| SCHEMBL2966892 | 1.00 | IGF1R (1.00) | IGF1REGFRERBB2CYP2D6 | |
| SCHEMBL2962503 | 0.93 | IGF1R (0.88) | IGF1REGFRERBB2CYP2D6 | |
| SCHEMBL2962500 | 0.93 | IGF1R (0.88) | IGF1REGFRERBB2CYP2D6 | |
| SCHEMBL2969343 | 0.93 | IGF1R (0.88) | IGF1REGFRERBB2CYP2D6 | |
| SCHEMBL2961140 | 0.92 | IGF1R (0.86) | IGF1REGFRERBB2CYP2D6 | |
| SCHEMBL2961138 | 0.92 | IGF1R (0.86) | IGF1REGFRERBB2CYP2D6 | |
| SCHEMBL2956062 | 0.92 | IGF1R (0.93) | IGF1REGFRERBB2CYP2D6 | |
| SCHEMBL2958515 | 0.92 | IGF1R (0.93) | IGF1REGFRERBB2CYP2D6 | |
| SCHEMBL2956060 | 0.92 | IGF1R (0.93) | IGF1REGFRERBB2CYP2D6 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 70 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-114561170-B | Insulating adhesive film and preparation method and application thereof | 深圳市纽菲斯新材料科技有限公司 | 2023-08-08 | — | — | CN | claimed |
| CN-113801473-B | Wave-absorbing bismaleimide resin, wave-absorbing bismaleimide resin composite material and preparation method thereof | 航天特种材料及工艺技术研究所 | 2023-06-09 | — | — | CN | claimed |
| CN-116178717-A | Preparation of modified bismaleimide resin | 华东理工大学 | 2023-05-30 | — | — | CN | claimed |
| CN-116042157-A | Low-dielectric flame-retardant lamination adhesive film for FCBGA packaging carrier plate and preparation method thereof | 深圳市纽菲斯新材料科技有限公司 | 2023-05-02 | — | — | CN | claimed |
| EP-1973917-B1 | PROTEIN KINASE INHIBITORS | ABBVIE INC (US) | 2015-06-10 | — | — | EP | claimed |
| US-7772231-B2 | Substituted pyrazolo[3,4-d]pyrimidines as protein kinase inhibitors | ABBOTT LABORATORIES (US) | 2010-08-10 | — | — | US | claimed |
| JP-55118436-A | — | — | None | — | — | JP | disclosed |
| US-20240209148-A1 | RESIN COMPOSITION FOR LOW-DIELECTRIC MATERIAL, FILM FOR MULTILAYER SUBSTRATE, MULTILAYER SUBSTRATE, METHOD FOR PRODUCING RESIN COMPOSITION FOR LOW-DIELECTRIC MATERIAL, METHOD FOR PRODUCING FILM FOR MULTILAYER SUBSTRATE, AND METHOD FOR PRODUCING MULTILAYER SUBSTRATE | NATIONAL UNIVERSITY CORPORATION, IWATE UNIVERSITY (JP) | 2024-06-27 | — | — | US | disclosed |
| US-11975507-B2 | Thermosetting resin composition, prepreg containing same, metal foil-clad laminate and printed circuit board | SHENGYI TECHNOLOGY CO., LTD. (CN) | 2024-05-07 | — | — | US | disclosed |
| CN-111656874-B | Multilayer printed circuit board, method for manufacturing the same, and semiconductor device using the same | 株式会社LG化学 | 2024-01-26 | — | — | CN | disclosed |
| CN-114181652-B | Insulating adhesive film with low dielectric loss and preparation method and application thereof | 深圳市纽菲斯新材料科技有限公司 | 2024-01-09 | — | — | CN | disclosed |
| CN-110637256-B | Material for forming film for lithography, composition for forming film for lithography, underlayer film for lithography, and pattern forming method | 三菱瓦斯化学株式会社 | 2024-01-09 | — | — | CN | disclosed |
| CN-111601850-B | Thermosetting resin composition for semiconductor encapsulation, prepreg and metal clad laminate using the same | 株式会社LG化学 | 2024-01-02 | — | — | CN | disclosed |
| US-5948149-A | SEMI-POLAR DIGLYCERIN BORATE ADDITIVE COMPOUND EXHIBITS SUPERIOR WETTABILITY, SURFACE TENSION, AND ANTIBACTERIAL PROPERTIES | SONY CORPORATION (JP) | 1999-09-07 | — | — | US | disclosed |
| US-4840869-A | 2-HALOMETHYL-1,3,4-OXADIAZOLE COMPOUNDS | KONISHIROKU PHOTO INDUSTRY CO., LTD. (JP) | 1989-06-20 | — | — | US | disclosed |
| EP-0118766-B1 | LIGHT-SENSITIVE COMPOSITION | KONICA CORPORATION (JP) | 1989-01-04 | — | — | EP | disclosed |
| EP-0118766-A2 | Light-sensitive composition | KONICA CORPORATION (JP) | 1984-09-19 | — | — | EP | disclosed |
| JP-S55118436-A | PREPARATION OF 2-TERTIARY-ALKYL-SUBSTITUTED ANTHRAQUINONE | MITSUBISHI GAS CHEM CO INC | 1980-09-11 | — | — | JP | disclosed |
| US-4098114-A | Recording sheet | FUJI PHOTO FILM CO., LTD. (JP) | 1978-07-04 | — | — | US | disclosed |
| US-4073968-A | IRRADIATING A PHOTOCURABLE COMPOSITION | FUJI PHOTO FILM CO., LTD. (JA) | 1978-02-14 | — | — | US | disclosed |