SCHEMBL29606558

SCHEMBL29606558

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nearest known ligand 0.32

Predicted protein targets (top 1)

geneUniProtsupporting neighboursconfidence
HSD17B10 Q99714 1/20 0.32

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
Hydrochloric Acid SCHEMBL14840264 0.97 HSD17B10 (0.31) HSD17B10
Bromide SCHEMBL14840142 0.97 HSD17B10 (0.31) HSD17B10
Water SCHEMBL14840297 0.97 HSD17B10 (0.31) HSD17B10
Oxalic Acid SCHEMBL899510 0.81
Oxalic Acid SCHEMBL899459 0.80
Oxalic Acid SCHEMBL898423 0.80
SCHEMBL27614010 0.79 CYP3A4 (0.41) HSD17B10
SCHEMBL10040056 0.77 HSD17B10 (0.36) HSD17B10
SCHEMBL14066275 0.77 HSD17B10 (0.36) HSD17B10
SCHEMBL19565414 0.77 CYP3A4 (0.39) HSD17B10

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 2 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
WO-2022124191-A1 THERMOSETTING EPOXY RESIN COMPOSITION, MOLDED ARTICLE FROM THERMOSETTING EPOXY RESIN, MOLDING MATERIAL FOR FIBER-REINFORCED COMPOSITE MATERIAL, FIBER-REINFORCED COMPOSITE MATERIAL, AND METHOD FOR PRODUCING FIBER-REINFORCED COMPOSITE MATERIAL 東レ株式会社 2022-06-16 WO disclosed
WO-2022102467-A1 THERMOSETTING EPOXY RESIN COMPOSITION, MOLDED ARTICLE OF SAME, FIBER-REINFORCED COMPOSITE MATERIAL, MOLDING MATERIAL FOR FIBER-REINFORCED COMPOSITE MATERIALS, AND METHOD FOR PRODUCING FIBER-REINFORCED COMPOSITE MATERIAL 東レ株式会社 2022-05-19 WO disclosed