SCHEMBL29619587

SCHEMBL29619587

C=Cc1ccc(CCc2cccc(C=C)c2)cc1

nearest known ligand 0.45

Predicted protein targets (top 17)

geneUniProtsupporting neighboursconfidence
TP53 P04637 1/20 0.45
TDP1 Q9NUW8 1/20 0.45
ALDH1A1 P00352 2/20 0.44
TSHR P16473 1/20 0.44
CYP19A1 P11511 1/20 0.42
MAOA P21397 4/20 0.39
MAOB P27338 4/20 0.39
OPRM1 P35372 4/20 0.37
OPRD1 P41143 4/20 0.37
OPRK1 P41145 4/20 0.37
FAAH O00519 1/20 0.36
PLAU P00749 1/20 0.34
CA1 P00915 1/20 0.33
CA2 P00918 1/20 0.33
CYP4F2 P78329 1/20 0.33
CYP4A11 Q02928 1/20 0.33
F2 P00734 1/20 0.33

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL28980107 1.00 TP53 (0.45) TP53TDP1ALDH1A1TSHRCYP19A1
SCHEMBL29619561 1.00 TP53 (0.45) TP53TDP1ALDH1A1TSHRCYP19A1
SCHEMBL1646708 1.00 TP53 (0.45) TP53TDP1ALDH1A1TSHRCYP19A1
SCHEMBL595303 1.00 TP53 (0.45) TP53TDP1ALDH1A1TSHRCYP19A1
SCHEMBL29619588 1.00 TP53 (0.45) TP53TDP1ALDH1A1TSHRCYP19A1
SCHEMBL1648714 0.98 TP53 (0.44) TP53TDP1ALDH1A1TSHRCYP19A1
SCHEMBL29619582 0.98 TP53 (0.44) TP53TDP1ALDH1A1TSHRCYP19A1
SCHEMBL28980213 0.98 TP53 (0.44) TP53TDP1ALDH1A1TSHRCYP19A1
SCHEMBL1646925 0.96 TP53 (0.48) TP53TDP1ALDH1A1TSHRCYP19A1
SCHEMBL29619625 0.96 TP53 (0.48) TP53TDP1ALDH1A1TSHRCYP19A1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 6 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-122071610-A Resin composition and use thereof 台燿科技股份有限公司 2026-05-22 CN disclosed
CN-119859358-A Resin composition and use thereof 台燿科技股份有限公司 2025-04-22 CN disclosed
CN-113667232-B Resin composition, prepreg, metal foil laminate and printed wiring board each produced using the same 台燿科技股份有限公司 2023-09-01 CN disclosed
CN-111285980-B Halogen-free low dielectric resin composition, prepreg, metal foil laminate and printed wiring board using the same 台燿科技股份有限公司 2023-02-28 CN disclosed
WO-2023007982-A1 PHOSPHORUS COMPOUND HAVING ISOCYANURATE RING, SYNTHETIC METHOD THEREFOR, AND USE OF SAID PHOSPHORUS COMPOUND HAVING ISOCYANURATE RING 四国化成工業株式会社 2023-02-02 WO disclosed
CN-110862668-B Halogen-free low dielectric resin composition, and prepreg, metal foil laminate and printed wiring board manufactured using the same 台燿科技股份有限公司 2022-05-06 CN disclosed