SCHEMBL29620331

SCHEMBL29620331

O=C(N[C@H](C(=O)O)c1ccccc1)OCC1c2ccccc2-c2ccccc21

nearest known ligand 0.55

Predicted protein targets (top 9)

geneUniProtsupporting neighboursconfidence
KMT2A Q03164 2/20 0.53
CASP3 P42574 3/20 0.53
MDM4 O15151 3/20 0.53
TP53 P04637 3/20 0.53
ATM Q13315 1/20 0.50
EPHX2 P34913 1/20 0.50
FABP7 O15540 1/20 0.46
FABP5 Q01469 1/20 0.46
MDM2 Q00987 1/20 0.46

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL29400606 1.00 KMT2A (0.53) KMT2ACASP3MDM4TP53ATM
SCHEMBL30851468 1.00 KMT2A (0.53) KMT2ACASP3MDM4TP53ATM
SCHEMBL29620335 1.00 KMT2A (0.53) KMT2ACASP3MDM4TP53ATM
SCHEMBL119848 1.00 KMT2A (0.53) KMT2ACASP3MDM4TP53ATM
SCHEMBL118281 1.00 KMT2A (0.53) KMT2ACASP3MDM4TP53ATM
SCHEMBL29401270 1.00 KMT2A (0.53) KMT2ACASP3MDM4TP53ATM
SCHEMBL29384904 1.00 KMT2A (0.53) KMT2ACASP3MDM4TP53ATM
SCHEMBL2307241 1.00 KMT2A (0.53) KMT2ACASP3MDM4TP53ATM
SCHEMBL6507736 0.92 KMT2A (0.52) KMT2ACASP3MDM4TP53ATM
SCHEMBL31734716 0.92 KMT2A (0.52) KMT2ACASP3MDM4TP53ATM

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-115989341-A Method for manufacturing structure with conductive pattern 旭化成株式会社 2023-04-18 CN disclosed
CN-115968113-A Method for manufacturing structure with conductive pattern, kit and system 旭化成株式会社 2023-04-14 CN disclosed
EP-4106764-A1 IMMUNE CELL MODULATORS Octagon Therapeutics Inc. (US) 2022-12-28 EP disclosed
WO-2022085461-A1 METHOD FOR MANUFACTURING CONDUCTIVE PATTERN-PROVIDED STRUCTURE 旭化成株式会社 2022-04-28 WO disclosed