SCHEMBL29630889

SCHEMBL29630889

[Ag].[Ag].[Cu].[Cu].[Cu].[Zn]

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL20446652 1.00
SCHEMBL1140758 1.00
SCHEMBL29973936 0.87
SCHEMBL28987900 0.87
SCHEMBL29536695 0.87
SCHEMBL28495395 0.87
Water SCHEMBL4575660 0.87
SCHEMBL28853293 0.87
SCHEMBL18488949 0.87
SCHEMBL31551000 0.87

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 2 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-114505614-B Solder and preparation method and application thereof 中国机械总院集团宁波智能机床研究院有限公司 2024-05-14 CN disclosed
CN-114505614-A Brazing filler metal and preparation method and application thereof 中机智能装备创新研究院(宁波)有限公司 2022-05-17 CN disclosed