SCHEMBL2971552

SCHEMBL2971552

CCc1ccc(P)cc1

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL27652909 0.97 TP53 (0.48) —
Hydrochloric Acid SCHEMBL27875664 0.97 TP53 (0.48) —
Hydrochloric Acid SCHEMBL7177260 0.97 TP53 (0.48) —
Hydrochloric Acid SCHEMBL4457967 0.94 TP53 (0.46) —
SCHEMBL12205767 0.92 TP53 (0.43) —
SCHEMBL20591151 0.87 TP53 (0.40) —
SCHEMBL36295 0.83 TP53 (0.67) —
SCHEMBL31498555 0.79 TP53 (0.62) —
SCHEMBL7542835 0.79 TP53 (0.62) —
Ammonia Solution, Strong SCHEMBL27293386 0.79 TP53 (0.62) —

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 179 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-118755476-A Display panel bottom-ITO etching solution, preparation method and application thereof 浙江奥首材料科技有限公司 2024-10-11 — — CN claimed
CN-117362338-A Method for preparing 3, 3-diaryl allyl substituted organic phosphonate compound 湖南理工学院 2024-01-09 — — CN claimed
CN-115925743-A Method for preparing (2-oxo-2-aryl ethyl) diaryl phosphine oxide compound 湖南理工学院 2023-04-07 — — CN claimed
CN-1835793-A Microencapsulated catalyst-ligand system, methods of preparation and methods of use thereof REAXA LTD (GB) 2006-09-20 — — CN claimed
CN-118755476-A Display panel bottom-ITO etching solution, preparation method and application thereof 浙江奥首材料科技有限公司 2024-10-11 — — CN disclosed
CN-118325282-A Resin composition 味之素株式会社 2024-07-12 — — CN disclosed
CN-118250904-A Method for manufacturing circuit board 味之素株式会社 2024-06-25 — — CN disclosed
CN-118185233-A Resin composition 味之素株式会社 2024-06-14 — — CN disclosed
CN-118185428-A Resin composition layer 味之素株式会社 2024-06-14 — — CN disclosed
CN-112940452-B Resin composition 味之素株式会社 2024-06-07 — — CN disclosed
CN-118082316-A Resin sheet with metal foil 味之素株式会社 2024-05-28 — — CN disclosed
CN-118076697-A Resin composition 味之素株式会社 2024-05-24 — — CN disclosed
US-20040206362-A1 Medical member and medical instrument JSR CORPORATION (JP) 2004-10-21 — — US disclosed
CN-1511176-A Oil extended 1,2-polybutadiene and method of manufacturing polybutadiene, and composition and formed product thereof JSR株式会社 2004-07-07 — — CN disclosed
CN-1454221-A 1, 2-polybutadiene, thermoplastic elastomer composition and polymer composition JSR CORP (JP) 2003-11-05 — — CN disclosed
CN-1384106-A Phosphonium salts, process for producing the same, use thereof, phosphine produced from the phosphonium salts and process for producing the same KURARAY CO (JP) 2002-12-11 — — CN disclosed
CN-1314921-A Ethylene (co) polymers and their use MITSUI CHEMICALS INC (JP) 2001-09-26 — — CN disclosed
CN-1278834-A gas phase polymerization of vinyl polybutadiene UNION CARBIDE CHEM PLASTIC (US) 2001-01-03 — — CN disclosed
US-5557016-A HYDROXYLATION OF CONJUGATED ALKADIENES IN THE PRESENCE OF PALLADIUM CATALYSIS MITSUBISHI KASEI CORPORATION (JP) 1996-09-17 — — US disclosed
US-4399302-A 4-Methylmercapto-2-acetoxy-butyraldehyde DEGUSSA AKTIENGESELLSCHAFT (DE) 1983-08-16 — — US disclosed
Send feedback