⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL301634 | 1.00 | — | — | |
| SCHEMBL3193737 | 1.00 | — | — | |
| SCHEMBL1901657 | 1.00 | — | — | |
| SCHEMBL436317 | 0.93 | — | — | |
| SCHEMBL661517 | 0.86 | — | — | |
| SCHEMBL8509805 | 0.86 | — | — | |
| Potassium Ion SCHEMBL2792103 | 0.86 | — | — | |
| SCHEMBL525512 | 0.86 | — | — | |
| SCHEMBL20942946 | 0.86 | — | — | |
| SCHEMBL5069917 | 0.86 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 1441 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-12439528-B2 | Method of preparing a high density interconnect printed circuit board including microvias filled with copper | Atotech Deutschland GmbH & Co. KG (DE) | 2025-10-07 | — | — | US | claimed |
| US-20250198033-A1 | Systems for Electrochemical Additive Manufacturing While Modifying Electrolyte Solutions | FABRIC8LABS | 2025-06-19 | — | — | US | claimed |
| US-12264405-B2 | Methods for electrochemical additive manufacturing while modifying electrolyte solutions | Fabric8Labs, Inc. (US) | 2025-04-01 | — | — | US | claimed |
| CN-115458724-B | High-energy-density composite positive electrode material and preparation method and application thereof | 中国科学院深圳先进技术研究院 | 2025-03-25 | — | — | CN | claimed |
| CN-119661545-A | Preparation method and application of metal phthalocyanine compound with high-efficiency photothermal conversion capability | 浙江理工大学 | 2025-03-21 | — | — | CN | claimed |
| US-12245383-B2 | Method of preparing a high density interconnect printed circuit board including microvias filled with copper | Atotech Deutschland GmbH & Co. KG (DE) | 2025-03-04 | — | — | US | claimed |
| CN-119086840-A | Method for detecting concentration of brightening agent in electroplating solution and reagent for measuring concentration of brightening agent in electroplating solution | 广东东硕科技有限公司 | 2024-12-06 | — | — | CN | claimed |
| CN-119059883-A | Method for copper-catalyzed dynamic racemization of chiral biaryl compound of chiral quaternary ammonium salt co-crystallization induced shaft | 复旦大学 | 2024-12-03 | — | — | CN | claimed |
| CN-118651838-B | Modification method of lithium iron manganese phosphate | 四川大学 | 2024-11-26 | — | — | CN | claimed |
| CN-115926109-B | Imidazole urea bond self-healing elastomer based on copper ion coordination | 东华大学 | 2024-11-22 | — | — | CN | claimed |
| US-5078912-A | Water dilutable formulation containing copper salt, ethanolamine, fungicidal anion and alkali; nonpolluting | DR. WOLMAN GMBH (DE) | 1992-01-07 | — | — | US | claimed |
| US-5059243-A | TETRA AZA LIGAND SYSTEMS AS COMPLEXING AGENTS FOR ELECTROLESS DEPOSITION OF COPPER | INTERNATIONAL BUSINESS MACHINES CORPORATION (US) | 1991-10-22 | — | — | US | claimed |
| US-4832801-A | COPPER ALLOYS, COMPOSITES | DAIDO METAL COMPANY LTD (JP) | 1989-05-23 | — | — | US | claimed |
| EP-0096034-B1 | ELECTROLESS COPPER DEPOSITION SOLUTIONS | MACDERMID, INCORPORATED (US) | 1986-09-10 | — | — | EP | claimed |
| EP-0096034-A4 | ELECTROLESS COPPER DEPOSITION SOLUTIONS. | MACDERMID INC (US) | 1984-05-03 | — | — | EP | claimed |
| EP-0096034-A1 | ELECTROLESS COPPER DEPOSITION SOLUTIONS. | MACDERMID INC (US) | 1983-12-21 | — | — | EP | claimed |
| WO-1983002287-A1 | ELECTROLESS COPPER DEPOSITION SOLUTIONS | MACDERMID INC (US) | 1983-07-07 | — | — | WO | claimed |
| US-4374709-A | PRETREATMENT WITH CONDITIONING SOLUTION CONTAINING COPPER IONS, ACID, AND A POLYETHER | OCCIDENTAL CHEMICAL CORPORATION (US) | 1983-02-22 | — | — | US | claimed |
| US-4325990-A | Electroless copper deposition solutions with hypophosphite reducing agent | MACDERMID INCORPORATED (US) | 1982-04-20 | — | — | US | claimed |
| US-4211828-A | COPPER IONS, COMPLEXING AGENT, CONDUCTION | ATLANTIC RICHFIELD COMPANY (US) | 1980-07-08 | — | — | US | claimed |