⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL22478 | 0.96 | — | — | |
| SCHEMBL8591536 | 0.96 | — | — | |
| Lithium Ion SCHEMBL1241828 | 0.92 | — | — | |
| SCHEMBL7176102 | 0.92 | — | — | |
| SCHEMBL6375637 | 0.92 | — | — | |
| Silver SCHEMBL607877 | 0.92 | — | — | |
| SCHEMBL6376782 | 0.92 | — | — | |
| SCHEMBL5495036 | 0.92 | — | — | |
| SCHEMBL7208057 | 0.92 | — | — | |
| Lithium Ion SCHEMBL133525 | 0.92 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 5 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-20240321803-A1 | PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, AND SEMICONDUCTOR DEVICE | SUMITOMO BAKELITE CO., LTD. (JP) | 2024-09-26 | — | — | US | disclosed |
| US-20240272551-A1 | NEGATIVE-TYPE PHOTOSENSITIVE POLYMER, POLYMER SOLUTION, NEGATIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, AND SEMICONDUCTOR DEVICE | SUMITOMO BAKELITE CO., LTD. (JP) | 2024-08-15 | — | — | US | disclosed |
| WO-2022270527-A1 | NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, NEGATIVE PHOTOSENSITIVE POLMER, CURED FILM AND SEMICONDUCTOR DEVICE | 住友ベークライト株式会社 | 2022-12-29 | — | — | WO | disclosed |
| WO-2022270529-A1 | NEGATIVE PHOTOSENSITIVE POLYMER, POLYMER SOLUTION, NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, AND SEMICONDUCTOR DEVICE | 住友ベークライト株式会社 | 2022-12-29 | — | — | WO | disclosed |
| WO-2022172988-A1 | PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, AND SEMICONDUCTOR DEVICE | 住友ベークライト株式会社 | 2022-08-18 | — | — | WO | disclosed |