⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL2201629 | 0.96 | — | — | |
| SCHEMBL297308 | 0.96 | — | — | |
| SCHEMBL7794435 | 0.96 | — | — | |
| SCHEMBL4547753 | 0.86 | — | — | |
| SCHEMBL42200 | 0.86 | — | — | |
| SCHEMBL4547755 | 0.86 | — | — | |
| SCHEMBL13448867 | 0.86 | — | — | |
| SCHEMBL13232694 | 0.86 | — | — | |
| SCHEMBL768193 | 0.86 | — | — | |
| SCHEMBL13838896 | 0.86 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 750 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-12512313-B2 | Method of forming low-k material layer with high-frequency power, structure including the layer, and system for forming same | ASM IP HOLDING B.V. (NL) | 2025-12-30 | — | — | US | claimed |
| WO-2025264567-A1 | LOW-K FILM COEFFICIENT OF THERMAL EXPANSION MODULATION BY UV TREATMENT | APPLIED MATERIALS, INC. (US) | 2025-12-26 | — | — | WO | claimed |
| US-20250391656-A1 | LOW-K FILM COEFFICIENT OF THERMAL EXPANSION MODULATION BY UV TREATMENT | APPLIED MATERIALS INC (US) | 2025-12-25 | — | — | US | claimed |
| US-20250357107-A1 | RF PULSING ASSISTED LOW-K MATERIAL DEPOSITION WITH HIGH DENSITY | APPLIED MATERIALS, INC. (US) | 2025-11-20 | — | — | US | claimed |
| US-20250343032-A1 | SUBSTRATE PROCESSING APPARATUS WITH TEMPERATURE CONTROLLER | ASM IP HOLDING BV (NL) | 2025-11-06 | — | — | US | claimed |
| WO-2025049147-A1 | METHODS FOR FORMING LOW-K DIELECTRIC MATERIALS WITH REDUCED DIELECTRIC CONSTANT AND HIGH MECHANICAL STRENGTH | APPLIED MATERIALS, INC. (US) | 2025-03-06 | — | — | WO | claimed |
| US-20250069884-A1 | METHODS FOR FORMING LOW-K DIELECTRIC MATERIALS WITH REDUCED DIELECTRIC CONSTANT AND HIGH MECHANICAL STRENGTH | APPLIED MATERIALS, INC. (US) | 2025-02-27 | — | — | US | claimed |
| WO-2025040760-A1 | COATING COMPOSITIONS | MOMENTIVE PERFORMANCE MATERIALS GMBH (DE) | 2025-02-27 | — | — | WO | claimed |
| WO-2025038375-A1 | METHODS FOR FORMING LOW-Κ DIELECTRIC MATERIALS WITH REDUCED DIELECTRIC CONSTANT AND INCREASED DENSITY | APPLIED MATERIALS, INC. (US) | 2025-02-20 | — | — | WO | claimed |
| US-20250062117-A1 | METHODS FOR FORMING LOW-K DIELECTRIC MATERIALS WITH REDUCED DIELECTRIC CONSTANT AND INCREASED DENSITY | APPLIED MATERIALS, INC. (US) | 2025-02-20 | — | — | US | claimed |
| US-7125488-B2 | Polar-modified bonded phase materials for chromatographic separations | VARIAN, INC. (US) | 2006-10-24 | — | — | US | claimed |
| US-20060122351-A1 | Ultraviolet transmissive polyhedral silsesquioxane polymers | PANASONIC ELECTRIC WORKS CO., LTD. (JP) | 2006-06-08 | — | — | US | claimed |
| US-20050178730-A1 | Polar-modified bonded phase materials for chromatographic separations | AGILENT TECHNOLOGIES, INC. | 2005-08-18 | — | — | US | claimed |
| US-6818570-B2 | Method of forming silicon-containing insulation film having low dielectric constant and high mechanical strength | ASM JAPAN K.K. (JP) | 2004-11-16 | — | — | US | claimed |
| US-20030176030-A1 | Method of forming silicon-containing insulation film having low dielectric constant and high mechanical strength | ASM JAPAN K.K. (JP) | 2003-09-18 | — | — | US | claimed |
| EP-1342809-A1 | Method of forming a low dialectric constant insulation film | ASM JAPAN K.K. (JP) | 2003-09-10 | — | — | EP | claimed |
| EP-0698632-B1 | Process for preparing organosiloxane terminated with silanol group | SHINETSU CHEMICAL CO (JP) | 2001-11-21 | — | — | EP | claimed |
| US-5576408-A | Process for preparing low molecular weight organosiloxane terminated with silanol group | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 1996-11-19 | — | — | US | claimed |
| US-5391677-A | Acrylic-functional organopolysiloxane and method for the preparation thereof | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 1995-02-21 | — | — | US | claimed |
| EP-0443860-B1 | Method for preparing liquid chromatograph packing material, and material produced thereby | CHEMICALS INSPECTION & TESTING (JP) | 1994-02-09 | — | — | EP | claimed |