SCHEMBL29913895

SCHEMBL29913895

CC(C)CCCCCCCOP(OCCCCCCCC(C)C)Oc1ccccc1.CC(C)CCCCCCCP(O)(O)(O)C(CCCCCCC(C)C)c1ccccc1

nearest known ligand 0.32

Predicted protein targets (top 3)

geneUniProtsupporting neighboursconfidence
RARB P10826 1/20 0.32
GPR88 Q9GZN0 1/20 0.31
HPGD P15428 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL108804 0.83 RARB (0.39) RARBGPR88HPGD
SCHEMBL17433581 0.83 RARB (0.39) RARBGPR88HPGD
SCHEMBL1100667 0.83 RARB (0.39) RARBGPR88HPGD
SCHEMBL1975756 0.83 AOC3 (0.36) GPR88
SCHEMBL381783 0.83 AOC3 (0.36) GPR88
SCHEMBL17439194 0.83 AOC3 (0.36) GPR88
SCHEMBL10941115 0.82 AOC3 (0.33) GPR88
SCHEMBL10941109 0.82 RARB (0.40) RARBGPR88HPGD
Hydrochloric Acid SCHEMBL9008281 0.80 RARB (0.38) RARBGPR88HPGD
SCHEMBL78491 0.80 RARB (0.39) RARBGPR88HPGD

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-119505337-A Foam body 财团法人工业技术研究院 2025-02-25 CN disclosed
CN-115926470-B Curable composition and electronic device comprising same 财团法人工业技术研究院 2024-05-07 CN disclosed
CN-115066461-A Resin composition having excellent adhesion and conductivity, and molded article thereof 韩华思路信株式会社 2022-09-16 CN disclosed
CN-115052744-A Multi-layer molded article having excellent adhesion and conductivity, and electronic product conveyed by the same 韩华思路信株式会社 2022-09-13 CN disclosed