SCHEMBL29936607

SCHEMBL29936607

CCC(N)(CC)CC(N)(CC)CC

nearest known ligand 0.33

Predicted protein targets (top 2)

geneUniProtsupporting neighboursconfidence
TSHR P16473 1/20 0.33
TDP1 Q9NUW8 1/20 0.33

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL44443 0.82
SCHEMBL24368036 0.82 TSHR (0.44) TSHRTDP1
SCHEMBL3240978 0.82 TSHR (0.35) TSHRTDP1
SCHEMBL14492137 0.79 TSHR (0.33) TSHRTDP1
SCHEMBL14377556 0.79 TSHR (0.33) TSHRTDP1
Fluoride SCHEMBL191143 0.78
Ammonia Solution, Strong SCHEMBL3400813 0.78
Bromide SCHEMBL1566336 0.78
Iodide SCHEMBL1567793 0.78
Hydrochloric Acid SCHEMBL659839 0.78

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 9 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-4650033-A1 CARBON CAPTURE Infineum International Limited (GB) 2025-11-19 EP disclosed
EP-4551742-A1 USE OF A COMPOSITION COMPRISING A POLYAMINOAMIDE TYPE COMPOUND FOR COPPER NANOTWIN ELECTRODEPOSITION BASF SE (DE) 2025-05-14 EP disclosed
CN-113785243-B Composition for resist pattern metallization process 日产化学株式会社 2025-05-02 CN disclosed
EP-4409058-A1 COMPOSITION FOR COPPER ELECTRODEPOSITION COMPRISING A POLYAMINOAMIDE TYPE LEVELING AGENT BASF SE (DE) 2024-08-07 EP disclosed
WO-2024008562-A1 USE OF A COMPOSITION COMPRISING A POLYAMINOAMIDE TYPE COMPOUND FOR COPPER NANOTWIN ELECTRODEPOSITION BASF SE (DE) 2024-01-11 WO disclosed
CN-117304068-A Preparation method for synthesizing 2, 2-diisopropyl propionitrile from 2, 3-dimethylbutyramide 濮阳天源生物科技有限公司 2023-12-29 CN disclosed
CN-117080543-A Polyelectrolyte composition and preparation method thereof 科腾聚合物荷兰有限责任公司 2023-11-17 CN disclosed
EP-4127025-A1 COMPOSITION FOR COPPER BUMP ELECTRODEPOSITION COMPRISING A POLYAMINOAMIDE TYPE LEVELING AGENT BASF SE (DE) 2023-02-08 EP disclosed
CN-115335434-A Composition for copper bump electrodeposition comprising polyaminoamide type leveling agent 巴斯夫欧洲公司 2022-11-11 CN disclosed