SCHEMBL2994038

SCHEMBL2994038

C=C[Si](OC)(OC)OC[Si](C)(C)C

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL129233 0.75
SCHEMBL7262128 0.74
SCHEMBL29088996 0.73
SCHEMBL647931 0.73
SCHEMBL28077167 0.73
SCHEMBL22614 0.73
SCHEMBL14823510 0.72
SCHEMBL8435398 0.71
SCHEMBL6854209 0.71
SCHEMBL931214 0.70

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 8 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-12391823-B2 Polyethylene composition for improving adhesion to polyurethane resins BOREALIS AG (AT) 2025-08-19 US disclosed
EP-3962999-B1 POLYETHYLENE COMPOSITION FOR IMPROVING ADHESION TO POLYURETHANE RESINS BOREALIS AG (AT) 2024-10-23 EP disclosed
US-11965063-B2 Method for preparing a siloxane based polymeric liquid material and materials made therefrom EMPA Eidgenoessische Matereialpruefungs- und Forschungsanstalt (CH) 2024-04-23 US disclosed
CN-113728047-B Polyethylene composition for improving adhesion to polyurethane resin 博里利斯股份公司 2023-09-26 CN disclosed
US-20220162429-A1 POLYETHYLENE COMPOSITION FOR IMPROVING ADHESION TO POLYURETHANE RESINS BOREALIS AG (AT) 2022-05-26 US disclosed
US-20220089819-A1 METHOD FOR PREPARING A SILOXANE BASED POLYMERIC LIQUID MATERIAL AND MATERIALS MADE THEREFROM EMPA EIDGENOESSISCHE MATERIALPRUEFUNGS- UND FORSCHUNGSANSTALT (CH) 2022-03-24 US disclosed
US-20100174103-A1 MATERIAL FOR FORMING SILICON-CONTAINING FILM, AND SILICON-CONTAINING INSULATING FILM AND METHOD FOR FORMING THE SAME JSR CORPORATION (JP) 2010-07-08 US disclosed
EP-2123658-A1 MATERIAL FOR FORMING SILICON-CONTAINING FILM, AND SILICON-CONTAINING INSULATING FILM AND METHOD FOR FORMING THE SAME JSR Corporation (JP) 2009-11-25 EP disclosed