SCHEMBL29958700

SCHEMBL29958700

O[Si](O)(O)O.[Al]

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
Calcium SCHEMBL29587498 0.91
Water SCHEMBL29370894 0.91
Magnesium SCHEMBL29871137 0.91
SCHEMBL9863243 0.91
SCHEMBL9433731 0.91
SCHEMBL30687316 0.91
SCHEMBL6264766 0.89
SCHEMBL8425118 0.89
SCHEMBL11227552 0.89
SCHEMBL1170 0.89

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 8 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-115275522-B Lithium-supplementing diaphragm and preparation method and application thereof 宁德卓高新材料科技有限公司 2023-03-24 CN claimed
CN-115275522-A Lithium-supplementing diaphragm and preparation method and application thereof 宁德卓高新材料科技有限公司 2022-11-01 CN claimed
CN-116139922-B Method for increasing molecular sieve particle surface adhesion 中国科学院长春应用化学研究所 2025-03-07 CN disclosed
CN-114808275-B Fiber felt with heat insulation performance and preparation method thereof 巩义市泛锐熠辉复合材料有限公司 2023-10-27 CN disclosed
CN-115275522-B Lithium-supplementing diaphragm and preparation method and application thereof 宁德卓高新材料科技有限公司 2023-03-24 CN disclosed
CN-115275522-A Lithium-supplementing diaphragm and preparation method and application thereof 宁德卓高新材料科技有限公司 2022-11-01 CN disclosed
CN-112322028-B Polyurethane low-density heat-conducting gel and preparation method thereof 深圳市傲川科技有限公司 2022-10-28 CN disclosed
CN-115117318-A Preparation process of mesoporous aluminum oxyhydroxide-coated lithium battery positive electrode material 大连交通大学 2022-09-27 CN disclosed