SCHEMBL30007261

SCHEMBL30007261

C=C(C)C(=O)Oc1ccccc1-c1ccccc1OC(=O)C(=C)C

nearest known ligand 0.51

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
ELANE P08246 1/20 0.51
KDM4E B2RXH2 4/20 0.41
ALDH1A1 P00352 4/20 0.41
TSHR P16473 3/20 0.41
TDP1 Q9NUW8 2/20 0.41
HSD17B10 Q99714 2/20 0.41
ESR1 P03372 1/20 0.41
ITGB3 P05106 1/20 0.41
ITGA2B P08514 1/20 0.41
HMGB1 P09429 1/20 0.41
HPGD P15428 1/20 0.41
GGT1 P19440 1/20 0.41
PTGS1 P23219 1/20 0.41
PTGS2 P35354 1/20 0.41
BLM P54132 1/20 0.41
NAPRT Q6XQN6 1/20 0.41
ATM Q13315 2/20 0.41
LMNA P02545 2/20 0.41
CYP1A2 P05177 1/20 0.41
CYP2C9 P11712 1/20 0.41

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL10399814 1.00 ELANE (0.51) ELANEKDM4EALDH1A1TSHRTDP1
SCHEMBL24811310 0.94 ELANE (0.51) ELANEKDM4EALDH1A1TSHRTDP1
SCHEMBL29819709 0.91 ELANE (0.45) ELANEKDM4EALDH1A1TSHRTDP1
SCHEMBL16192523 0.91 ELANE (0.45) ELANEKDM4EALDH1A1TSHRTDP1
SCHEMBL29636626 0.91 FABP7 (0.48) ELANEKDM4EALDH1A1TSHRTDP1
SCHEMBL22381407 0.89 ELANE (0.44) ELANEKDM4EALDH1A1TSHRTDP1
SCHEMBL245711 0.89 ELANE (0.44) ELANEKDM4EALDH1A1TSHRTDP1
SCHEMBL30803750 0.89 ELANE (0.56) ELANEKDM4EALDH1A1TSHRTDP1
SCHEMBL1232932 0.89 ELANE (0.56) ELANEKDM4EALDH1A1TSHRTDP1
SCHEMBL30803748 0.89 ELANE (0.56) ELANEKDM4EALDH1A1TSHRTDP1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 1 patent. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-115461381-A Acid group-containing (meth) acrylate resin, curable resin composition, insulating material, resin material for solder resist, and resist member DIC株式会社 2022-12-09 CN disclosed