SCHEMBL300185

SCHEMBL300185

CCC(O)=S.CCC(O)=S.CCC(O)=S.CCC(O)=S

nearest known ligand 0.43

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
FFAR3 O14843 1/20 0.43
ALDH1A1 P00352 4/20 0.35
CYP3A4 P08684 2/20 0.35
TDP1 Q9NUW8 2/20 0.33
TSHR P16473 2/20 0.33
CA12 O43570 5/20 0.32
CA1 P00915 5/20 0.32
CA2 P00918 5/20 0.32
CA9 Q16790 5/20 0.32
EHMT2 Q96KQ7 3/20 0.32
EHMT1 Q9H9B1 3/20 0.32
ABCB11 O95342 2/20 0.32
HTT P42858 2/20 0.32
GSDMD P57764 2/20 0.32
CA4 P22748 2/20 0.32
CYP2E1 P05181 1/20 0.32
PTGS1 P23219 1/20 0.32
PHGDH O43175 1/20 0.30
PLIN1 O60240 1/20 0.30
GMNN O75496 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL10768078 1.00
SCHEMBL285140 1.00 FFAR3 (0.43) FFAR3ALDH1A1CYP3A4TDP1TSHR
SCHEMBL28909413 1.00 FFAR3 (0.43) FFAR3ALDH1A1CYP3A4TDP1TSHR
SCHEMBL111807 1.00
Ethane SCHEMBL5581157 0.95 FFAR3 (0.40) FFAR3ALDH1A1CYP3A4TDP1TSHR
Fluoride SCHEMBL11039310 0.95
Hydrochloric Acid SCHEMBL18185340 0.95 FFAR3 (0.40) FFAR3ALDH1A1CYP3A4TDP1TSHR
Methane SCHEMBL9008507 0.95 FFAR3 (0.40) FFAR3ALDH1A1CYP3A4TDP1TSHR
SCHEMBL4165623 0.95 FFAR3 (0.40) FFAR3ALDH1A1CYP3A4TDP1TSHR
SCHEMBL28959747 0.95

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 32 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-2058346-B1 RESIN COMPOSITION FOR OPTICAL MATERIAL AND OPTICAL MATERIAL USING THE SAME MITSUBISHI GAS CHEMICAL CO (JP) 2012-03-07 EP claimed
EP-1223190-B1 Room temperature curable organopolysiloxane composition for molding SHINETSU CHEMICAL CO (JP) 2011-10-12 EP claimed
EP-1608704-B1 THIOPHOSPHINE COMPOUNDS AND METHOD OF MAKING POLYMERISABLE COMPOSITIONS CONTAINING THEM AND THEIR USE FOR MAKING OPHTALMIC LENSES ESSILOR INT (FR) 2008-03-19 EP claimed
US-6242149-B1 LIGHT SENSITIVE ELEMENTS CURED WITH RADIATION, RADICAL POLYMERIZATION, PHOTOPOLYMERIZATION, ENCAPSULATION BROTHER KOGYO KABUSHIKI KAISHA (JP) 2001-06-05 US claimed
EP-3246366-B1 AQUEOUS INK, INK CARTRIDGE, AND INK JET RECORDING METHOD CANON KK (JP) 2024-04-10 EP disclosed
US-20240043607-A1 CURABLE RESIN COMPOSITION THREEBOND CO., LTD. (JP) 2024-02-08 US disclosed
EP-4249569-A1 LUMINESCENT PARTICLES AND PRODUCTION METHOD THEREFOR, LUMINESCENT-PARTICLE DISPERSION, PHOTOCONVERSION FILM, LAYERED PRODUCT, PHOTOCONVERSION LAYER, COLOR FILTER, AND LUMINESCENT ELEMENT DIC Corporation (JP) 2023-09-27 EP disclosed
WO-2023136275-A1 (METH)ACRYLIC RESIN COMPOSITION AND MOLDED ARTICLE USING SAME, AND METHOD FOR PRODUCING (METH)ACRYLIC RESIN COMPOSITION 株式会社日本触媒 2023-07-20 WO disclosed
EP-4130058-A1 METHACRYLIC COPOLYMER, COMPOSITION, SHAPED OBJECT, METHOD FOR PRODUCING FILM OR SHEET, AND LAYERED PRODUCT Kuraray Co., Ltd. (JP) 2023-02-08 EP disclosed
EP-3885399-A1 CURABLE COMPOSITION FOR MECHANICAL FOAMING, AND METHOD FOR MANUFACTURING FOAM OF SAME ThreeBond Co., Ltd. (JP) 2021-09-29 EP disclosed
WO-2021132487-A1 SEALANT SHEET WITH RELEASE LINER 日東電工株式会社 2021-07-01 WO disclosed
WO-2021132486-A1 LAYERED BODY 日東電工株式会社 2021-07-01 WO disclosed
EP-2103636-A1 FLUORINE-CONTAINING POLYMER AND RESIN COMPOSITION Chisso Corporation (JP) 2009-09-23 EP disclosed
US-20090202749-A1 CURABLE RESIN COMPOSITION, CURABLE RESIN COMPOSITION FOR FORMING PHOTOSENSITIVE PATTERN, COLOR FILTER, LIQUID CRYSTAL PANEL SUBSTRATE AND LIQUID CRYSTAL PANEL HAYASHI SHINJI 2009-08-13 US disclosed
US-7537810-B2 Curable resin composition, photosensitive pattern-forming curable resin composition, color filter, substrate for liquid crystalline panel, and liquid crystalline panel DAI NIPPON PRINTING CO., LTD. (JP) 2009-05-26 US disclosed
US-7429409-B2 UV-crosslinking block copolymers TESA AG (DE) 2008-09-30 US disclosed
US-20060229376-A1 Curable resin composition, photosensitive pattern-forming curable resin composition,color filter, substrate for liquid crystalline panel, and liquid crystalline panel DAI NIPPON PRINTING CO., LTD. (JP) 2006-10-12 US disclosed
US-20050250906-A1 UV-crosslinking block copolymers TESA AG (DE) 2005-11-10 US disclosed
US-20010044024-A1 Acrylic hot melt pressure-sensitive adhesive and protective film utilizing the same NIPPON SHOKUBAI CO., LTD. (JP) 2001-11-22 US disclosed
US-6242149-B1 LIGHT SENSITIVE ELEMENTS CURED WITH RADIATION, RADICAL POLYMERIZATION, PHOTOPOLYMERIZATION, ENCAPSULATION BROTHER KOGYO KABUSHIKI KAISHA (JP) 2001-06-05 US disclosed