SCHEMBL30085602

SCHEMBL30085602

FC(F)(F)c1ccccc1P(c1ccccc1)c1ccccc1

nearest known ligand 0.46

Predicted protein targets (top 18)

geneUniProtsupporting neighboursconfidence
TDP1 Q9NUW8 2/20 0.46
CYP3A4 P08684 1/20 0.46
ALDH1A1 P00352 4/20 0.37
TSHR P16473 1/20 0.37
DRD1 P21728 2/20 0.37
ESR1 P03372 2/20 0.37
ESR2 Q92731 2/20 0.37
POLB P06746 1/20 0.36
L3MBTL1 Q9Y468 1/20 0.36
IDO1 P14902 2/20 0.34
GAA P10253 2/20 0.33
KDM4E B2RXH2 2/20 0.33
LMNA P02545 1/20 0.33
HPGD P15428 1/20 0.33
ATM Q13315 1/20 0.33
AR P10275 1/20 0.33
ACP3 P15309 1/20 0.33
HSD11B1 P28845 1/20 0.32

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL10792614 1.00 TDP1 (0.46) TDP1CYP3A4ALDH1A1TSHRDRD1
SCHEMBL30637851 0.98 TDP1 (0.44) TDP1CYP3A4ALDH1A1TSHRDRD1
Hydrochloric Acid SCHEMBL10791630 0.96 TDP1 (0.42) TDP1CYP3A4ALDH1A1TSHRDRD1
Bromide SCHEMBL10795459 0.96 TDP1 (0.42) TDP1CYP3A4ALDH1A1TSHRDRD1
Hydrochloric Acid SCHEMBL10791016 0.96 TDP1 (0.42) TDP1CYP3A4ALDH1A1TSHRDRD1
Hydrochloric Acid SCHEMBL10795466 0.96 TDP1 (0.42) TDP1CYP3A4ALDH1A1TSHRDRD1
Bromide SCHEMBL10795463 0.96 TDP1 (0.42) TDP1CYP3A4ALDH1A1TSHRDRD1
SCHEMBL9854376 0.96 TDP1 (0.46) TDP1CYP3A4ALDH1A1TSHRDRD1
SCHEMBL6752713 0.89 TDP1 (0.41) TDP1CYP3A4ALDH1A1TSHRDRD1
SCHEMBL15698213 0.87 CYP3A4 (0.46) TDP1CYP3A4ALDH1A1TSHRDRD1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 1 patent. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-115066465-A Composition, heat conduction material, heat conduction sheet and device with heat conduction layer 富士胶片株式会社 2022-09-16 CN disclosed