SCHEMBL30239503

SCHEMBL30239503

[Mn+2].[O-2].[Ta+5]

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL18603146 1.00
SCHEMBL331735 0.87
SCHEMBL20162287 0.82
SCHEMBL34398 0.82
SCHEMBL31694990 0.82
SCHEMBL11654272 0.82
SCHEMBL29085 0.82
SCHEMBL1902881 0.82
SCHEMBL20598435 0.82
SCHEMBL3779810 0.82

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 6 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-12482704-B2 Self-forming barrier for use in air gap formation ADEIA SEMICONDUCTOR SOLUTIONS LLC (US) 2025-11-25 US disclosed
US-12315807-B2 Reducing copper line resistance INTERNATIONAL BUSINESS MACHINES CORPORATION (US) 2025-05-27 US disclosed
US-20240395702-A1 SEMICONDUCTOR INTERCONNECT STRUCTURE WITH DOUBLE CONDUCTORS BANK OF AMERICA, N.A., AS COLLATERAL AGENT 2024-11-28 US disclosed
US-12087685-B2 Semiconductor interconnect structure with double conductors TESSERA LLC (US) 2024-09-10 US disclosed
US-20230335438-A1 SELF-FORMING BARRIER FOR USE IN AIR GAP FORMATION ADEIA SEMICONDUCTOR SOLUTIONS LLC 2023-10-19 US disclosed
US-11587830-B2 Self-forming barrier for use in air gap formation TESSERA LLC (US) 2023-02-21 US disclosed