SCHEMBL3025455

SCHEMBL3025455

CCc1nccn1C(C)N

nearest known ligand 0.34

Predicted protein targets (top 10)

geneUniProtsupporting neighboursconfidence
TLR8 Q9NR97 2/20 0.34
MAPT P10636 1/20 0.33
ALPG P10696 2/20 0.32
TSHR P16473 2/20 0.32
PLAA Q9Y263 1/20 0.32
ALPL P05186 1/20 0.31
MAPK1 P28482 1/20 0.31
FPR2 P25090 2/20 0.31
KCNH2 Q12809 1/20 0.31
ALDH1A1 P00352 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL28862101 1.00 TLR8 (0.34) TLR8MAPTALPGTSHRPLAA
SCHEMBL27867130 0.85 KCNH2 (0.33) TLR8KCNH2ALDH1A1
SCHEMBL4077931 0.83 MAPT (0.35) TLR8MAPTALPGTSHRPLAA
SCHEMBL10477774 0.82 TLR8 (0.33) TLR8MAPTALPGTSHRPLAA
Hydrochloric Acid SCHEMBL11091398 0.81 TLR8 (0.35) TLR8ALPGTSHRPLAAALPL
SCHEMBL14271655 0.80 ADORA2A (0.37) MAPTALPGTSHRPLAAALPL
SCHEMBL19486318 0.80 MAPT (0.33) TLR8MAPTALPGTSHRPLAA
SCHEMBL27867134 0.79 TLR7 (0.41) TLR8TSHRALDH1A1
SCHEMBL27850132 0.79 TLR7 (0.41) TLR8TSHRALDH1A1
SCHEMBL27867165 0.79 TLR7 (0.41) TLR8TSHRALDH1A1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 117 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-118970122-A Polybenzimidazole proton exchange membrane with cross-linked structure and preparation method and application thereof 陕西煤业化工技术研究院有限责任公司 2024-11-15 CN claimed
CN-112724867-B Insulating adhesive film material and preparation method and application thereof 深圳先进技术研究院 2023-01-10 CN claimed
WO-2021108955-A1 HIGH FREQUENCY LOW-LOSS INSULATING ADHESIVE FILM MATERIAL AND PREPARATION METHOD THEREFOR 中国科学院深圳先进技术研究院 2021-06-10 WO claimed
CN-112724867-A Insulating adhesive film material and preparation method and application thereof 深圳先进技术研究院 2021-04-30 CN claimed
EP-0239246-B1 NOVEL IMIDAZOLE COMPOUNDS, PROCESS FOR SYNTHESIS THEREOF, AND METHOD OF CURING EPOXY RESINS USING SAID COMPOUNDS SHIKOKU CHEMICALS CORPORATION (JP) 1990-05-16 EP claimed
EP-0239246-A1 Novel imidazole compounds, process for synthesis thereof, and method of curing epoxy resins using said compounds SHIKOKU CHEMICALS CORPORATION (JP) 1987-09-30 EP claimed
CN-118970122-A Polybenzimidazole proton exchange membrane with cross-linked structure and preparation method and application thereof 陕西煤业化工技术研究院有限责任公司 2024-11-15 CN disclosed
US-12077705-B2 Liquid crystal polyester and film comprising the same SUMITOMO CHEMICAL COMPANY, LIMITED (JP) 2024-09-03 US disclosed
EP-4015545-B1 ACRYLIC RUBBER, CROSSLINKABLE RUBBER COMPOSITION, AND RUBBER CURED PRODUCT DENKA COMPANY LTD (JP) 2024-05-29 EP disclosed
CN-116199866-B Liquid crystal polyester, method for producing liquid crystal polyester, liquid crystal polyester composition, film, method for producing film, and circuit board 住友化学株式会社 2024-03-19 CN disclosed
CN-116199865-B Liquid crystal polyester, method for producing liquid crystal polyester, liquid crystal polyester composition, film, method for producing film, and circuit board 住友化学株式会社 2024-03-19 CN disclosed
US-11926779-B2 Liquid crystal polyester and film comprising the same SUMITOMO CHEMICAL COMPANY, LIMITED (JP) 2024-03-12 US disclosed
US-20230295513-A1 LIQUID CRYSTAL POLYESTER AND FILM COMPRISING THE SAME SUMITOMO CHEMICAL COMPANY, LIMITED (JP) 2023-09-21 US disclosed
US-5494757-A BLEND OF A PIPERAZINYLETHYLAMIDOCARBONYL-CONTAINING BUTADIENE-ACRYLONITRILE TERPOLYMER AND A MALEIMIDE RESIN TOMOEGAWA PAPER CO., LTD. (JP) 1996-02-27 US disclosed
EP-0651040-A1 Liquid adhesive for electronic parts and process for forming insulating adhesive layer using the same TOMOEGAWA PAPER CO. LTD. (JP) 1995-05-03 EP disclosed
EP-0649892-A1 Adhesive tape for electronic parts and liquid adhesive TOMOEGAWA PAPER CO. LTD. (JP) 1995-04-26 EP disclosed
EP-0649893-A1 Adhesive tape for electronic parts and liquid adhesive TOMOEGAWA PAPER CO. LTD. (JP) 1995-04-26 EP disclosed
EP-0239246-B1 NOVEL IMIDAZOLE COMPOUNDS, PROCESS FOR SYNTHESIS THEREOF, AND METHOD OF CURING EPOXY RESINS USING SAID COMPOUNDS SHIKOKU CHEMICALS CORPORATION (JP) 1990-05-16 EP disclosed
US-4826991-A Production of 1-aminoethyl-imidazoles via the hydrolysis of 1-acylaminoethylimidazoles SHIKOKU CHEMICALS CORPORATION (JP) 1989-05-02 US disclosed
EP-0239246-A1 Novel imidazole compounds, process for synthesis thereof, and method of curing epoxy resins using said compounds SHIKOKU CHEMICALS CORPORATION (JP) 1987-09-30 EP disclosed