⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| Hydrochloric Acid SCHEMBL6849656 | 0.97 | — | — | |
| SCHEMBL67972 | 0.96 | — | — | |
| SCHEMBL8668054 | 0.96 | — | — | |
| SCHEMBL8857941 | 0.93 | — | — | |
| Water SCHEMBL18764007 | 0.93 | — | — | |
| SCHEMBL15632626 | 0.87 | — | — | |
| SCHEMBL8829102 | 0.80 | — | — | |
| SCHEMBL8465358 | 0.78 | — | — | |
| SCHEMBL14735547 | 0.78 | — | — | |
| SCHEMBL15674322 | 0.72 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 1138 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-118176577-A | Silicone composition for potting electronic components | 迈图高新材料公司 | 2024-06-11 | — | — | CN | claimed |
| CN-117683462-A | Preparation method and application of friction-resistant heat-conducting material | 东莞中诺创新材料科技有限公司 | 2024-03-12 | — | — | CN | claimed |
| CN-115109562-B | Double-component high-heat-dissipation high-conductivity organic silicon pouring sealant and preparation method thereof | 广州白云科技股份有限公司 | 2024-03-12 | — | — | CN | claimed |
| CN-117487169-A | End capping agent, preparation method thereof and application of end capping agent in silicone rubber sealant | 北京天山新材料技术有限公司 | 2024-02-02 | — | — | CN | claimed |
| CN-117165258-A | Adhesive glue, use method thereof and preparation method of tackifier | 浙江申禾丽阳科技有限公司 | 2023-12-05 | — | — | CN | claimed |
| CN-113416519-B | Organic silicon gel for encapsulating IGBT module | 广州回天新材料有限公司 | 2023-05-02 | — | — | CN | claimed |
| CN-115678286-A | Easily-filled and easily-repaired heat-conducting gel and preparation method thereof | 四川天邑康和通信股份有限公司 | 2023-02-03 | — | — | CN | claimed |
| CN-115109562-A | Bi-component high-heat-dissipation high-conductivity organic silicon pouring sealant and preparation method thereof | 广州市白云化工实业有限公司 | 2022-09-27 | — | — | CN | claimed |
| CN-115058227-A | Addition type organic silicon road adhesive and preparation method thereof | 广州市白云化工实业有限公司 | 2022-09-16 | — | — | CN | claimed |
| CN-113648452-B | In-vivo in-situ foaming material | 北京大学口腔医院 | 2022-08-19 | — | — | CN | claimed |
| EP-0355600-A2 | Method for reducing silicone foam density, and silicone foam compositions | GENERAL ELECTRIC COMPANY (US) | 1990-02-28 | — | — | EP | claimed |
| EP-0355429-A2 | Method for reducing silicone foam density and silicone foam compositions | GENERAL ELECTRIC COMPANY (US) | 1990-02-28 | — | — | EP | claimed |
| US-4904414-A | DISPERSION OF CROSSLINKED POLYSILOXANES, SILVER PARTICLES, SILICA FILLER | SIEMENS AKTIENGESELLSCHAFT (DE) | 1990-02-27 | — | — | US | claimed |
| US-4879317-A | POLYSILOXANES, ALCOHOL, PLATINUM CATALYST | GENERAL ELECTRIC COMPANY (US) | 1989-11-07 | — | — | US | claimed |
| US-4855328-A | Method for reducing silicone foam density | GENERAL ELECTRIC COMPANY (US) | 1989-08-08 | — | — | US | claimed |
| US-4840974-A | USING MIXTURE OF PLATINUM VINYL SILOXANE AND PLATINUM TRIARYLPHOSPHINE CATALYST MIXTURE | GENERAL ELECTRIC COMPANY (US) | 1989-06-20 | — | — | US | claimed |
| US-4593084-A | Catalyst | DOE CORNING CORPORATION (US) | 1986-06-03 | — | — | US | claimed |
| EP-0182611-A2 | Platinum-phosphine-vinylsiloxane complexes | DOW CORNING CORPORATION (US) | 1986-05-28 | — | — | EP | claimed |
| US-4184006-A | BLEND INCLUDING END-CAPPED POLYSILOXANE WHICH IS CRO>SLINKED | WACKER-CHEMIE GMBH (DE) | 1980-01-15 | — | — | US | claimed |
| US-4072635-A | Organosiloxane gels | GENERAL ELECTRIC COMPANY (US) | 1978-02-07 | — | — | US | claimed |