⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL31563659 | 0.87 | — | — | |
| SCHEMBL6750801 | 0.87 | — | — | |
| SCHEMBL2126236 | 0.87 | — | — | |
| SCHEMBL29385872 | 0.87 | — | — | |
| SCHEMBL9492110 | 0.75 | — | — | |
| SCHEMBL6759412 | 0.75 | — | — | |
| SCHEMBL2126286 | 0.75 | — | — | |
| SCHEMBL31084253 | 0.75 | — | — | |
| SCHEMBL10476762 | 0.75 | — | — | |
| SCHEMBL31436118 | 0.75 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 14 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-224240238-U | Semiconductor plastic package die | 成都尚明工业有限公司 | 2026-05-15 | — | — | CN | disclosed |
| CN-224224393-U | Semiconductor plastic package material pretreatment device | 成都尚明工业有限公司 | 2026-05-12 | — | — | CN | disclosed |
| CN-222883519-U | Semiconductor packaging module | 西安美科思半导体技术有限公司 | 2025-05-16 | — | — | CN | disclosed |
| CN-222826411-U | Lead frame | 甬矽电子(宁波)股份有限公司 | 2025-05-02 | — | — | CN | disclosed |
| CN-115172217-B | Die bonder single-head four-swing-arm die bonder | 深圳平晨半导体科技有限公司 | 2025-04-25 | — | — | CN | disclosed |
| CN-222749492-U | Lead frame's base island | 甬矽电子(宁波)股份有限公司 | 2025-04-11 | — | — | CN | disclosed |
| CN-119560458-A | Semiconductor packaging structure, packaging method thereof and electronic equipment | 华为技术有限公司 | 2025-03-04 | — | — | CN | disclosed |
| CN-222320181-U | Tabletting structure for semiconductor packaging | 深圳市亿昊精密半导体设备有限公司 | 2025-01-07 | — | — | CN | disclosed |
| CN-222190699-U | Semiconductor optical chip encapsulation positioning fixture | 东方强光（北京)科技有限公司 | 2024-12-17 | — | — | CN | disclosed |
| CN-110164827-B | Integrated forming packaging structure and packaging process thereof | 河源市富宇光电科技有限公司 | 2024-07-26 | — | — | CN | disclosed |
| CN-110265307-B | Method for manufacturing semiconductor package and package structure thereof | 湖南省矽茂半导体有限责任公司 | 2024-03-29 | — | — | CN | disclosed |
| CN-115966492-B | Packaging tool of automatic semiconductor IC carrier plate combining machine | 方泰(广东)科技有限公司 | 2023-08-18 | — | — | CN | disclosed |
| CN-116469820-A | Discharging and carrying device of semiconductor packaging equipment | 深圳市普天注塑机械设备有限公司 | 2023-07-21 | — | — | CN | disclosed |
| CN-219097119-U | Novel carrier tape conveying mechanism | 深圳市诺泰芯装备有限公司 | 2023-05-30 | — | — | CN | disclosed |