SCHEMBL303603

SCHEMBL303603

O=S(=O)([O-])c1cccc2ccccc12.c1ccc([S+](c2ccccc2)c2ccccc2)cc1

nearest known ligand 0.50

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
CA1 P00915 1/20 0.50
CA2 P00918 1/20 0.50
CA9 Q16790 1/20 0.50
F2 P00734 3/20 0.46
PRSS1 P07477 3/20 0.46
PRSS2 P07478 3/20 0.46
PRSS3 P35030 3/20 0.46
HTR6 P50406 2/20 0.46
MEN1 O00255 1/20 0.41
KMT2A Q03164 1/20 0.41
TSHR P16473 2/20 0.40
PGR P06401 1/20 0.40
DUSP5 Q16690 1/20 0.40
KEAP1 Q14145 1/20 0.39
NFE2L2 Q16236 1/20 0.39
HCRTR1 O43613 1/20 0.39
SLC1A3 P43003 1/20 0.38
SLC1A2 P43004 1/20 0.38
SLC1A1 P43005 1/20 0.38
AKR1B1 P15121 1/20 0.38

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL12095551 0.87 CA1 (0.45) CA1CA2CA9F2PRSS1
SCHEMBL38662875 0.87 F2 (0.45) CA1CA2CA9F2PRSS1
SCHEMBL6757949 0.85 CA1 (0.41) CA1CA2CA9F2PRSS1
SCHEMBL4889621 0.85 CA1 (0.61) CA1CA2CA9F2PRSS1
SCHEMBL5684924 0.85 CA1 (0.61) CA1CA2CA9F2PRSS1
SCHEMBL4886341 0.85 CA1 (0.61) CA1CA2CA9F2PRSS1
SCHEMBL1948673 0.85 CA1 (0.61) CA1CA2CA9F2PRSS1
SCHEMBL4888590 0.85 CA1 (0.61) CA1CA2CA9F2PRSS1
Potassium Ion SCHEMBL10962719 0.85 CA1 (0.61) CA1CA2CA9F2PRSS1
Zinc Ion SCHEMBL1683962 0.85 CA1 (0.61) CA1CA2CA9F2PRSS1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 459 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20140335448-A1 PHOTOSENSITIVE SILOXANE RESIN COMPOSITION AZ ELECTRONIC MATERIALS USA CORP. (US) 2014-11-13 US claimed
US-8053158-B2 Photosensitive compositions useful for forming active patterns, methods of forming such active patterns and organic memory devices incorporating such active patterns SAMSUNG ELECTRONICS CO., LTD. (KR) 2011-11-08 US claimed
US-20070202436-A1 Photosensitive compositions useful for forming active patterns, methods of forming such active patterns and organic memory devices incorporating such active patterns SAMSUNG ELECTRONICS CO., LTD. (KR) 2007-08-30 US claimed
US-RE37179-E1 ADDITION POLYMER JSR CORPORATION (JP) 2001-05-15 US claimed
US-5994022-A BECOMES SOLUBLE IN ALKALI DEVELOPING SOLUTION BY ACTION OF AN ACID JSR CORPORATION (JP) 1999-11-30 US claimed
US-5679495-A TERPOLYMER PHOTORESIST CONTAINING VINYLPHENOL DERIVATIVE, TERT-BUTYL (METH)ACRYLATE, AND A UNIT TO REDUCE ALKALINE SOLUBILITY; DRY ETCH RESISTANCE JAPAN SYNTHETIC RUBBER CO., LTD. (JP) 1997-10-21 US claimed
CN-122043858-A EUV patterned resist formation method 亚历克斯·P·G·罗宾逊 2026-05-15 CN disclosed
CN-120077771-A Curable composition for organic EL element, cured product for organic EL element, method for producing cured product for organic EL element, and polymer JSR株式会社 2025-05-30 CN disclosed
WO-2025062940-A1 RESIN COMPOSITION, SUBSTRATE WITH PIEZOELECTRIC FILM, AND METHOD FOR PRODUCING SUBSTRATE WITH PIEZOELECTRIC FILM 東レ株式会社 2025-03-27 WO disclosed
CN-110850680-B Curable composition, display element, and method for forming cured film JSR株式会社 2024-10-25 CN disclosed
US-20240168383-A1 STRUCTURE FOR OPTICAL DEVICES, PROCESS FOR PREPARING THE SAME, AND PHOTOCURABLE SILOXANE RESIN COMPOSITION THEREFOR DUPONT SPECIALTY MATERIALS KOREA LTD (KR) 2024-05-23 US disclosed
CN-114690562-A Structure for optical device, method for preparing the same, and photocurable silicone resin composition for the same 罗门哈斯电子材料韩国有限公司 2022-07-01 CN disclosed
CN-113994256-A Method for forming EUV patterned resist 亚历克斯·P·G·罗宾逊 2022-01-28 CN disclosed
US-5558971-A HYDROXYSTYRENE POLYMER DERIVATIVES, PHOTOACID GENERATOR WAKO PURE CHEMICAL INDUSTRIES, LTD. (JP) 1996-09-24 US disclosed
US-5558976-A HYDROXYSTYRENE POLYMER DERIVATIVES, PHOTOACID GENERATOR, PHOTORESISTS WAKO PURE CHEMICAL INDUSTRIES, LTD. (JP) 1996-09-24 US disclosed
US-5556734-A RESISTS JAPAN SYNTHETIC RUBBER CO., LTD. (JP) 1996-09-17 US disclosed
EP-0726500-A1 Chemically amplified, radiation-sensitive resin composition JAPAN SYNTHETIC RUBBER CO., LTD. (JP) 1996-08-14 EP disclosed
EP-0704762-A1 Resist material and pattern formation WAKO PURE CHEMICAL INDUSTRIES LTD (JP) 1996-04-03 EP disclosed
EP-0660187-A1 Radiation-sensitive resin composition JAPAN SYNTHETIC RUBBER CO., LTD. (JP) 1995-06-28 EP disclosed
EP-0634696-A1 Chemically amplified resist composition JAPAN SYNTHETIC RUBBER CO., LTD. (JP) 1995-01-18 EP disclosed