SCHEMBL303670

SCHEMBL303670

O=C1OC2CCCCC12

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL52434 0.97 PRSS1 (0.36) —
SCHEMBL11805630 0.97 PRSS1 (0.36) —
SCHEMBL4046976 0.97 PRSS1 (0.36) —
SCHEMBL11803699 0.97 PRSS1 (0.36) —
SCHEMBL2962078 0.97 PRSS1 (0.36) —
SCHEMBL19212607 0.97 PRSS1 (0.36) —
SCHEMBL2954265 0.97 PRSS1 (0.36) —
SCHEMBL20618128 0.97 PRSS1 (0.36) —
SCHEMBL20617569 0.97 PRSS1 (0.36) —
SCHEMBL4046094 0.97 PRSS1 (0.36) —

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 71 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-7105275-B2 Positive resist composition and method of forming pattern using the same FUJI PHOTO FILM CO., LTD. (JP) 2006-09-12 — — US claimed
US-6824956-B2 ADDITION POLYMER CONTAINING UNITS OF AN ADAMANTYL ESTER HAVING HYDROXY GROUPS FUJI PHOTO FILM CO., LTD. (JP) 2004-11-30 — — US claimed
US-6787282-B2 Positive resist composition FUJI PHOTO FILM CO., LTD. (JP) 2004-09-07 — — US claimed
US-20030194640-A1 Positive resist composition FUJI PHOTO FILM CO., LTD. 2003-10-16 — — US claimed
EP-1338922-A2 Positive resist composition FUJI PHOTO FILM CO., LTD. (JP) 2003-08-27 — — EP claimed
US-20030108809-A1 Positive resist composition FUJI PHOTO FILM CO., LTD. 2003-06-12 — — US claimed
WO-2024070091-A1 ONIUM SALT, PHOTOACID GENERATOR, POLYMER, RESIST COMPOSITION, AND METHOD FOR MANUFACTURING DEVICE USING SAID RESIST COMPOSITION 東洋合成工業株式会社 2024-04-04 — — WO disclosed
US-11814498-B2 Polylactone foams and methods of making the same NOVOMER, INC. (US) 2023-11-14 — — US disclosed
US-11814498-B2 Polylactone foams and methods of making the same NOVOMER, INC. (US) 2023-11-14 — — US disclosed
US-20230340266-A1 SILICON-CONTAINING COMPOSITION AND METHOD FOR MANUFACTURING SEMICONDUCTOR SUBSTRATE JSR CORPORATION (JP) 2023-10-26 — — US disclosed
US-20230250238-A9 SILICON-CONTAINING COMPOSITION AND METHOD OF PRODUCING SEMICONDUCTOR SUBSTRATE JSR CORPORATION (JP) 2023-08-10 — — US disclosed
US-20230093664-A1 SILICON-CONTAINING COMPOSITION AND METHOD FOR MANUFACTURING SEMICONDUCTOR SUBSTRATE JSR CORPORATION (JP) 2023-03-23 — — US disclosed
US-20220403116-A1 SILICON-CONTAINING COMPOSITION AND METHOD OF PRODUCING SEMICONDUCTOR SUBSTRATE JSR CORPORATION (JP) 2022-12-22 — — US disclosed
US-20030194640-A1 Positive resist composition FUJI PHOTO FILM CO., LTD. 2003-10-16 — — US disclosed
US-20030162961-A1 Catalytic carbonylation of three and four membered heterocycles CORNELL RESEARCH FOUNDATION, INC. 2003-08-28 — — US disclosed
EP-1338922-A2 Positive resist composition FUJI PHOTO FILM CO., LTD. (JP) 2003-08-27 — — EP disclosed
WO-2003050154-A2 CATALYTIC CARBONYLATION OF THREE AND FOUR MEMBERED HETEROCYCLES CORNELL RESEARCH FOUNDATION, INC. (US) 2003-06-19 — — WO disclosed
US-20030108809-A1 Positive resist composition FUJI PHOTO FILM CO., LTD. 2003-06-12 — — US disclosed
US-6461788-B1 COMPOUNDS HAVING SPECIFIC CYCLOHEXANELACTONE STRUCTURE FORM POLYMERS HAVING HIGH TRANSPARENCY AT SHORT WAVELENGTH SUCH AS ARGON FLUORIDE EXCIMER LASER, EXCELLENT DRY ETCHING RESISTANCE AND SUBSTRATE ADHERENCE; USEFUL FOR RESISTS MARUZEN PETROCHEMICAL CO., LTD. (JP) 2002-10-08 — — US disclosed
US-6461788-B1 COMPOUNDS HAVING SPECIFIC CYCLOHEXANELACTONE STRUCTURE FORM POLYMERS HAVING HIGH TRANSPARENCY AT SHORT WAVELENGTH SUCH AS ARGON FLUORIDE EXCIMER LASER, EXCELLENT DRY ETCHING RESISTANCE AND SUBSTRATE ADHERENCE; USEFUL FOR RESISTS MARUZEN PETROCHEMICAL CO., LTD. (JP) 2002-10-08 — — US disclosed
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