SCHEMBL304346

SCHEMBL304346

CC(=O)C(Cc1ccccc1)(C(=O)c1ccc(N2CCOCC2)cc1)N(C)C

nearest known ligand 0.48

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
SMN1; SMN2 Q16637 3/20 0.48
MAPT P10636 7/20 0.46
ALDH1A1 P00352 2/20 0.46
L3MBTL1 Q9Y468 2/20 0.45
MAOB P27338 1/20 0.44
MEN1 O00255 3/20 0.43
KMT2A Q03164 3/20 0.43
GSK3B P49841 1/20 0.43
RAB9A P51151 2/20 0.42
ALOX12 P18054 1/20 0.42
AOC3 Q16853 2/20 0.41
NPC1 O15118 1/20 0.41
ATM Q13315 1/20 0.41
ESR1 P03372 1/20 0.41
PIK3CD O00329 1/20 0.40
PIK3CA P42336 1/20 0.40
PIK3CB P42338 1/20 0.40
PIK3CG P48736 1/20 0.40
PRKDC P78527 1/20 0.40
RORC P51449 1/20 0.40

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL15746779 0.88 NPC1 (0.39) SMN1; SMN2MAPTALDH1A1L3MBTL1MEN1
SCHEMBL8898916 0.85 SMN1; SMN2 (0.51) SMN1; SMN2MAPTALDH1A1L3MBTL1MAOB
SCHEMBL2774235 0.84 SMN1; SMN2 (0.50) SMN1; SMN2MAPTALDH1A1L3MBTL1MAOB
SCHEMBL8648697 0.83 MAPT (0.49) SMN1; SMN2MAPTALDH1A1L3MBTL1MAOB
SCHEMBL28131034 0.82 SMN1; SMN2 (0.48) SMN1; SMN2MAPTALDH1A1L3MBTL1MAOB
SCHEMBL3397043 0.82 SMN1; SMN2 (0.48) SMN1; SMN2MAPTALDH1A1L3MBTL1MAOB
SCHEMBL28990186 0.82 SMN1; SMN2 (0.48) SMN1; SMN2MAPTALDH1A1L3MBTL1MAOB
SCHEMBL35868 0.82 SMN1; SMN2 (0.48) SMN1; SMN2MAPTALDH1A1L3MBTL1MAOB
SCHEMBL623433 0.81 SMN1; SMN2 (0.49) SMN1; SMN2MAPTALDH1A1L3MBTL1MEN1
SCHEMBL537644 0.81 MEN1 (0.47) SMN1; SMN2MAPTALDH1A1L3MBTL1MAOB

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 53 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
WO-2023149394-A1 POLYMER, COMPOSITION, CURED PRODUCT, LAMINATED BODY, AND ELECTRONIC COMPONENT JSR株式会社 2023-08-10 WO disclosed
WO-2023017855-A1 RESIN COMPOSITION AND METHOD FOR PRODUCING SAME, AND COMPOSITE MATERIAL 昭和電工株式会社 2023-02-16 WO disclosed
WO-2023017853-A1 LINING MATERIAL 昭和電工株式会社 2023-02-16 WO disclosed
WO-2023017851-A1 METHOD FOR RENOVATING PIPE 昭和電工株式会社 2023-02-16 WO disclosed
WO-2023017852-A1 RESIN COMPOSITION AND MATERIAL FOR LINING MATERIAL 昭和電工株式会社 2023-02-16 WO disclosed
CN-107870514-B Photosensitive resin composition 株式会社田村制作所 2022-09-16 CN disclosed
CN-113166573-A Active energy ray-curable inkjet ink, inkjet recorded matter, and method for producing inkjet recorded matter 东洋油墨SC控股株式会社 2021-07-23 CN disclosed
WO-2021070710-A1 COMPOSITION, CURED ARTICLE, LAYERED BODY, AND ELECTRONIC COMPONENT JSR株式会社 2021-04-15 WO disclosed
CN-112020743-A Composition for sound-proof sheet member, and sound-proof structure 三菱化学株式会社 2020-12-01 CN disclosed
US-20170069843-A1 DEPOSITION MASK AND METHOD OF FABRICATING THE SAME SAMSUNG DISPLAY CO., LTD. (KR) 2017-03-09 US disclosed
US-20100003513-A1 ADHESIVE BONDING SHEET, SEMICONDUCTOR DEVICE USING THE SAME, AND METHOD FOR MANUFACTURING SUCH SEMICONDUCTOR DEVICE OOKUBO KEISUKE 2010-01-07 US disclosed
US-20100003512-A1 ADHESIVE BONDING SHEET, SEMICONDUCTOR DEVICE USING SAME, AND METHOD FOR MANUFACTURING SUCH SEMICONDUCTOR DEVICE OOKUBO KEISUKE 2010-01-07 US disclosed
EP-2128213-A1 ADHESIVE COMPOSITION FOR OPTICAL WAVEGUIDE, ADHESIVE FILM FOR OPTICAL WAVEGUIDE AND ADHESIVE SHEET FOR OPTICAL WAVEGUIDE EACH USING THE SAME, AND OPTICAL DEVICE USING ANY OF THEM Hitachi Chemical Company, Ltd. (JP) 2009-12-02 EP disclosed
US-7578891-B2 Adhesive bonding sheet, semiconductor device using the same, and method for manufacturing such semiconductor device HITACHI CHEMICAL COMPANY, LTD. (JP) 2009-08-25 US disclosed
EP-2090594-A1 ACTINIC-ENERGY-RAY-CURABLE WATER-BASED RESIN COMPOSITION, ACTINIC-ENERGY-RAY-CURABLE COATING MATERIAL, METHOD OF FORMING CURED COATING FILM, AND ARTICLE DIC Corporation (JP) 2009-08-19 EP disclosed
US-20090176337-A1 NEGATIVE PHOTORESIST COMPOSITION AND METHOD OF MANUFACTURING ARRAY SUBSTRATE USING THE SAME SAMSUNG ELECTRONICS CO., LTD. (KR) 2009-07-09 US disclosed
US-20090029289-A1 Photosensitive Resin Composition, Photosensitive Element, Method for Forming Resist Pattern and Method for Producing Printed Wiring Board RESONAC CORPORATION (JP) 2009-01-29 US disclosed
US-20080261039-A1 Adhesive Sheet and Method for Manufacturing the Same, Semiconductor Device Manufacturing Method and Semiconductor Device HITACHI CHEMICAL COMPANY, LTD. (JP) 2008-10-23 US disclosed
US-20070241436-A1 Adhesive Bonding Sheet, Semiconductor Device using the Same, and Method for Manufacturing such Semiconductor Device HITACHI CHEMICAL COMPANY, LTD. (JP) 2007-10-18 US disclosed
US-20070145358-A1 Transparent conductor and transparent conductive material TDK CORPORATION (JP) 2007-06-28 US disclosed